2024 3D InCites Awards Winner Circle
The Winner’s Circle
The Technology Enablement Awards
Carl Zeiss Microscopy
We’re incredibly honored to be selected by 3D InCites as a Technology Enablement Award recipient. ZEISS is proud to be the world’s leading manufacturer of light, electron and X-ray microscopes. We continually push boundaries to address the failure analysis challenges facing new packaging technologies required for 3D heterogenous integration to meet the performance needs of artificial intelligence (AI). Uniquely, AI provides a path to solving some of the challenges in building AI chips. For example, our investment in AI-powered solutions has helped us revolutionize our 3D X-ray and DeepRecon Pro and DeepScout products, resulting in faster scan times and higher-quality imaging.Thomas Rodgers, Senior Director and Head of Electronics Marketing Sector, Carl Zeiss Microscopy
Zeiss has revolutionized 3D X-ray microscopy with AI-powered, non-destructive imaging in its DeepRecon Pro and DeepScout products. DeepRecon Pro enhances thermocompression bonding (TCB) processes in 2.5 and 3D packages, reducing scan times for assessing alignments and accelerating process development cycles. DeepScout extends high-resolution 3D X-ray imaging benefits to reliability testing, construction analysis, and reverse engineering applications.
Multibeam
It is a special honor to be recognized with the 2024 Advanced Technology Enablement Award. When we re-innovated e-beam lithography for very high productivity, we quickly discovered that the full-wafer field-of-view, giant depth-of-focus, ultra-fine resolution, and flexibility of our direct-write patterning system make it a unique enabler of multi-die integration. We are proud to be among the leaders in the 3D InCites Community that are continuously driving new semiconductor manufacturing innovations especially for advanced packaging applications.Kenneth P. MacWilliams, President and Board Member, Multibeam Corporation Multibeam
Multibeam is addressing the slow cycle times of masked-based lithography technologies with its multi-column E-beam lithography (MEBL) solution. This maskless technology enhances multi-die integration with a large write field, high DoF, ultra-fine resolution, and adaptable writing. MEBL makes it possible to pattern more than 10X larger than current interposers, facilitating wafer-scale integration for processors like HPC, GPUs, and AI engines. With more than 100X DoF improvement over optical lithography, it enables advanced 3D structures and high-resolution interconnects, resulting in a 10x-100x increase in chip-to-chip interconnect bandwidth.
LPKF Laser & Electronics SE
We are really excited about the award and thankful for the visibility we gain through it. I feel it is really a good timing as glass substrates have built up so much momentum over the last few months. We are really proud that we have made such a significant contribution to this development with our mature LIDE technology. Roman Ostholt, LPKF Laser & Electronics
LPKF tackled the challenges of achieving precise and reliable through glass vias (TGVs) in glass substrates with its Laser-Induced Deep Etching (LIDE) technology. Using a non-ablative, single-pulse laser-based process, it is possible to achieve high aspect ratio, high-density TGV arrays without stress or microcracks. LIDE is ultra-fast and can create multiple structures in one step. It’s also compatible with a range of glass types, including thin and ultra-thin substrates. LIDE is said to be highly scalable and suitable for mass production.
Deca Technologies
The Deca team is deeply appreciative to have Adaptive Pad Stacks selected for this year’s 3DInCites technology enablement award. It's inspiring to be part of such an innovative and dynamic era in the advanced packaging industry. Let's continue to expand what's possible!Tim Olson, CEO, DECA
DECA is addressing embedded bridge die alignment issues with its Adaptive Pad Stacks. This innovation is expected to deliver an order-of-magnitude increase in the allowable die shift for embedded bridge die in molded fan-out interposers. This will safeguard against yield losses and facilitate the highest density interconnect on more complex devices, including cutting-edge AI processor applications. When integrated with DECA’s technologies such as Adaptive Alignment, Adaptive Routing, and Adaptive Metal Fill, Adaptive Pad Stacks provides a robust and comprehensive solution for foundries, OSATs, IDMs, and other industry players involved in designing and producing the most advanced HI chiplet assemblies of the future.
PulseForge
We are honored and grateful to the panel judges and readers of 3DInCites for recognizing PulseForge Photonic Debonding with this prestigious award. This acknowledgment is a testament to the dedication and ingenuity of our team. We are excited to collaborate with our customers to implement Photonic Debonding and help them achieve their advanced packaging goals.Jonathan Gibson, CEO PulseForge
PulseForge offers a solution to the ongoing throughput challenge of wafer debonding, with its Photonic Debonding (PDB)process. PDB uses high-intensity light pulses and a proprietary inorganic light-absorbing layer to efficiently separate temporarily bonded wafer pairs. Operating at room temperature, PDB is particularly advantageous for advanced packaging applications, enabling efficient debonding of ultra-thin wafers during back-end-of-line processing with increased final device yield.
Benefits over traditional laser debonding techniques include lower processing costs, minimal thermal impact, reduced mechanical strain, and ash-free debonding.
2024 Sustainability Award Winner
Brewer Science
It’s an honor for Brewer Science to be recognized as a sustainability leader. Spanning from our technology developments to our community engagements, we continually seek ways to use business for the betterment of our society. Whether you’re a customer in our industry, a supply chain partner, or a member of our community – we are all working together to better the world through continuous innovation.Matthew Beard, , Executive Director of Strategic Planning, Management Systems, and Sustainability
Brewer Science has long been an advocate of social and environmental responsibility. The 2021 B Corp certification pushed the company to advance all areas of ESG. Some highlights that helped the committee decide include:
– Achieving GreenCircle Certified Zero Waste to Landfill for the past eight years
– Keeping energy consumption constant despite production increases
– Aiming to reduce Scopes 1 and 2 GHG emissions by 80% by 2030
– Planning to report on Scope 3 emissions in 2024
– Expanding education around sustainability and waste reduction to all employees
2024 Adele Hars Award for DEI
ERS Electronic GmbH
Receiving the Adele Hars DEI Award serves as a powerful affirmation that we are on the right path towards a better and more inclusive workplace. We thank the committee for this recognition and for motivating us to redouble our efforts and break further boundaries. This achievement is owed to our incredible team, whose diverse perspectives fuel our innovation and success, so I extend my heartfelt thanks to the amazing ERS family who has made this possible.Laurent Giai-Miniet, CEO of ERS Electronic, GmbH
Overall, ERS Electronic has shown a strong commitment to diversity, equity, and inclusion. What tipped the scales for the committee was the number of roles held by women in senior leadership, and the active engagement of the CEO and senior leadership in improving the work environment. Other key points include:
– Dedicated leadership (Equal Opportunities Officer appointed in 2020)
– Diverse and inclusive Senior Management Team (SMT)
– A company ethos where an inclusive workplace culture is integral.
– Recognition that an inclusive workplace requires a collective effort.
– An environment where all employees feel heard and valued.
– Agreed upon core values such as fairness, respect, appreciation, and belonging.
– A safe, open space that encourages growth, empowerment, and continuous self-development.
– A supportive environment for career advancement.
– A strong commitment to supporting the community.
Best Place to Work Award
NHanced Semiconductors, Inc.
We are honored to receive the award for Best Place to Work in Microelectronics, but even more honored by our employees. Our team makes NHanced the company it is. At NHanced, our customers know that they are dealing with the best and brightest in the industry.Bob Patti, Founder and CEO, NHanced Semiconductor
NHanced Semiconductors captured 66% of its employee base to win this award. Fab Manager, Carl Pettaway submitted the following nomination:
Employees of NHanced are not only introduced to cutting-edge science but actively participate in the development of innovative processes that transform global technologies through shared decision-making and collaborative problem-solving. Opportunities for professional growth are accessible through mentorship, specialized training, and performance-based initiatives.
NHanced is committed to ensuring each employee has the skills, tools, knowledge, and resources needed to succeed. Above-average salaries and a comprehensive benefits package, including health insurance and matching 401(k) contributions, reflect the meaningful and novel influences on the advancement of technology in the semiconductor industry made by employees, whereas a generous paid time off policy supports a healthy work-life balance.
With several locations including Batavia Illinois, near Chicago, Odon Indiana, a rural community with a naval research center, and Morrisville North Carolina, near the Research Triangle Park technology hub, employees find working at NSI to be rewarding and fulfilling, both professionally and personally. No matter the location, opportunities for outdoor recreation, advanced education, and entertainment abound. Our diverse and talented employees are dedicated to building a culture of collaboration and supporting the growth of the semiconductor industry.
