US Chip Fabrication, Packaging & Assembly Industry In August 2023, one year after the U.S. CHIPs Act was signed into...
The February issue of Chip Scale Review contained an interesting article entitled “Heterogeneous Chiplet Integration to Make Megachips” authored by...
Onshoring SK hynix HBM Multiple reports indicate that SK Hynix is poised to announce its first major U.S. investment: A...
IFTLE has spent significant time discussing the lack of U.S.-based substrate manufacturing. Although packages such as the ball-grid array (BGA)...
At this year’s IEEE International Electron Device Meeting, [IEDM] (December in San Francisco) SK hynix gave an interesting look at...
As IFTLE has explained previously, Investments in semiconductors will not succeed without investments in advanced packaging. The CHIPS for America...
NIST held the “Chiplet Interfaces Technical Standards Workshop” at the NIST National Cybersecurity Center of Excellence in December 2023. During this...
The Scalable Asymmetric Lifecycle Engagement (SCALE) program is the nation’s preeminent workforce development effort, funded by the Department of Defense’s...
Also: US CHIPS Seeking < $300M Proposals TSMC’s Offshore Fabs Nikkei Asia is reporting that TSMC’s $8B Japan chip project...
Amkor Technology’s announcement to build a high-volume facility in the US, as well as the award winner announcements for the...
TSMC recently introduced its “3DFabric Alliance”, as part of its Open Innovation Platform (OIP), to help customers with the challenges...
Intel recently announced that it would use glass core substrates for advanced packaging in the second half of this decade....
Also STEAMPIPE winners and are Japan’s semiconductor materials companies acquisition targets? Arizona talks packaging with TSMC Ever since TSMC announced...
Microelectronics Commons The Microelectronics Commons is a Department of Defense (DoD) initiative that aims to create direct pathways to commercialization...
This week, we finish our look at papers presented during the IMAPS CHIPCon Conference held in July, 2023, where we...
This week, we continue our look at the presentations at the IMAPS CHIPCon conference that was held at the end...
Beginning August 1, 2023, China has imposed export restrictions on gallium (Ga) and germanium (Ge) products. These restrictions are seen as...
IMAPS CHIPCon conference was held at the end of July 2023. CHIPcon was created to focus on chiplets and Heterogeneous...
In Part 4 of my coverage of the IMAPS Onshoring Workshop, we look at how government agency roles impact onshoring...
Continuing our look at the IMAPS Onshoring conference with a look at U.S. OSAT activities. (We should note that while...