2017 3D InCites Awards
The 3D InCites Awards were established in 2013 to recognize achievements that further the commercialization of interposer and 3D integration technologies. In 2015, many of these technologies became productized, and are being recognized as part of the overall advanced packaging landscape for the value they bring to today’s electronic devices. In recognition of this evolution, 3D InCites and Impress foundation bring you the all-new 2017 3D InCites Awards program.
Nominations are open to all who would like to recognize a technology, individual, or company that has made a significant contribution to the advancement of 3D integration and related technologies, including interposer integration, advanced fan-out wafer-level packaging and 3D systems integration. Winners will be chosen by industry peers, through an online voting process.
The 2017 3D InCites Awards will be presented in the following categories:
- Device of the Year
- Engineer of the Year
- Foundry of the Year
- OSAT of the Year
- Fabless of the Year
- Startup of the Year
- Supplier of the Year
- Research Institute of the Year
- Lifetime Achievement Award
Sponsorship opportunities for 3D InCites Awards 2017 are available at the Platinum, Silver, and Participant levels. Event proceeds will benefit the 3D InCites Awards Scholarship Fund, which awards a $2,500 scholarship each year to a graduate of the SEMI High Tech U program.
The 2017 3D InCites Awards will be presented during a ceremony on Tuesday, July 12, 4:00 p.m. at the Impress Lounge, located above Moscone North, followed by the Impress SEMICON West after-party. Attendance is by invitation only.
Nominations open April 4, 2017 and close June 17, 2017. Online voting opens June 20, 2017 and closes July 8, 2017.