2018 3D InCites Awards

2018 3D InCites Awards

The 2018 3D InCites Awards recognize industrywide contributions in the development of heterogeneous integration technologies. This year. the event will be hosted International Microelectronics and Packaging Society during the IMAPS International Device Packaging Conference.

Nominations are open to all who would like to recognize a technology, individual, or company that has made a significant contribution to the advancement of the heterogeneous roadmap including 3D packaging, interposer integration, advanced fan-out wafer level packaging, MEMS and sensors, and full system integration. Winners will be chosen by industry peers, through an online voting process.

The 2018 3D InCites Awards will be presented in the following categories:

  • Device of the Year
  • Process of the Year
  • Device Manufacturer of the Year
  • Startup of the Year
  • Equipment Supplier of the Year
  • Materials Supplier of the Year
  • EDA Provider of the Year
  • Research Institute of the Year
  • Engineer of the Year

Sponsorship Opportunities for 2018 3D InCites Awards are available at the Platinum, Silver, and Participant levels. In 3D InCites’ ongoing commitment to STEM education and finding kid size cures for childhood cancer, the proceeds from this year’s event will benefit two charities: the IMAPS Microelectronics Foundation, which exists to support student activities related to the study of microelectronic packaging, interconnect and assembly; and Phoenix Children’s Hospital pediatric oncology programs, the only institution in Arizona conducting Phase I trials, giving pediatric cancer patients access to the latest and most advanced treatments available.

Nominations for the 2018 3D InCites Awards open Monday, January 8, 2018, and will be accepted until Monday, February 12, 2018. Online voting begins Wednesday, February 14, 2018, and closes Wednesday, 28 February 2018. Winners will be announced Wednesday, March 7, 2018, during an awards ceremony and cocktail reception at the 2018 IMAPS Device Packaging Conference, immediately following the Interactive Poster Session.