2022 3D InCites Awards

Silver Sponsors:

The 2022 3D InCites Awards program recognizes industry-wide contributions in the development of heterogeneous integration and 3D technologies. In 2021, we expanded our scope of coverage, adding a special focus on sustainable manufacturing efforts, as well as diversity equity and inclusion (DEI) with two special award categories.

This year’s program will begin with online nominations and voting (for the technology awards) and culminate in an in-person awards ceremony that takes place March 7 at the IMAPS Device Packaging Conference, in Fountain Hills, Arizona.

Nominations are open to all who would like to recognize technology, individual, or company that has made a significant contribution to the advancement of the heterogeneous roadmap including 3D packaging, interposer integration, advanced fan-out wafer-level packaging, MEMS and sensors, and full system integration.

This year, we are also accepting online nominations for companies that demonstrate best practices in sustainable semiconductor manufacturing, and diversity equity and inclusion (DEI). These companies will be considered as candidates for the 3D InCites Sustainability Award and the SemiSister Award, respectively.

Nominations open January 20, 2022, and close February 10, 2022. Winners will be chosen by a select panel of judges, as well as industry peers through an online voting process. Online voting for the technology awards begins February 16 and closes February 24, 2022. Winners will be notified on March 1, 2022, and awards will be presented at an in-person ceremony on March 7, 2022.

The 2022 3D InCites Awards will be presented in the following categories:

  • Device Technology of the Year
  • Process of the Year
  • Device Manufacturer of the Year
  • Startup of the Year
  • Equipment Supplier of the Year
  • Materials Supplier of the Year
  • The Herb Reiter Design Tool Award
  • Research Institute of the Year
  • Engineer of the Year
  • Sustainability Award
  • SemiSister Award for DEI

2022 Judges Panel

Michelle Bourke, Lam Research, Senior Director of Strategic Marketing, Customer Support Business Group
Phil Garrou, Microelectronics Consultants of North CarolinaPaul Franzon, Professor Department of Electrical and Computer Engineering, North Carolina State University
Beth Keser, President, International Microelectronics and Packaging Society, Director, Package Engineering at Intel
Steffen Kröhnert, President & Founder ESPAT-Consulting

Special Awards

The 3D InCites SemiSister Award recognizes a company or organization in the microelectronics industry that demonstrates significant efforts to foster gender diversity, equity, and inclusion in the workplace. This award will be decided by a special committee.

Margaret Kindling, Sr. Program Manager, Diversity, Equity, Inclusion, SEMI Foundation
Antoinette Hamilton, Lam Research, Global Head of Inclusion & Diversity
Joanne Itow, Managing Director, Semico Research

3D InCites Sustainability Award Committee 

Julia Goldstein, Owner, JLFG Communications, Author of Material Value
Dean Freeman, Chief Analyst, Freeman Technology and Market Advisors
Jennifer Yuen, Senior Director of Global Corporate Communications at ASE Group

Sponsorship Opportunities

Sponsorship Opportunities for the 2022 3D InCites Awards are available at the Platinum, Gold, Silver, and Participant levels. A portion of sponsorship proceeds will help seed the 3D InCites DEI Fund, established by the Impress Foundation to help tech start-ups owned by women or underrepresented minorities grow and thrive.

Additionally, in conjunction with the 3D InCites Awards, we will hold our annual Mural Fundraiser, with proceeds to benefit the DEI Fund. The Impress Foundation is a 501-C 3 designated non-profit organization.  

Important Dates:

  • Nominations Open: January 20-February 11, 2022
  • Voting Begins: February 16-February 24, 2022
  • Winners Notified: Monday, March 1, 2022
  • Awards Presented: Tuesday, March 8, 2022