2020 3D InCites Awards

2020 3D InCites Awards   The 2020 3D InCites Awards program recognizes industry-wide contributions in the development of heterogeneous integration technologies. This year. the event will be hosted in conjunction with the International Microelectronics and Packaging Society during the IMAPS International Device Packaging Conference.

Nominations Are Closed! Online voting opens February 3, 2020

See who has been nominated!

Nominations are open to all who would like to recognize a technology, individual, or company that has made a significant contribution to the advancement of the heterogeneous roadmap including 3D packaging, interposer integration, advanced fan-out wafer-level packaging, MEMS and sensors, and full system integration. Winners will be chosen by a select panel of judges in addition to industry peers, through an online voting process.

The 2020 3D InCites Awards will be presented in the following categories:

  • Device of the Year
  • Process of the Year
  • Device Manufacturer of the Year
  • Startup of the Year
  • Equipment Supplier of the Year
  • Materials Supplier of the Year
  • Design Tool Provider of the Year
  • Research Institute of the Year
  • Engineer of the Year

Sponsorship Opportunities for 2020 3D InCites Awards are still available at the Platinum, Silver, and Participant levels.

Online nominations will be open from January 13-29, 2020. New this year: Winners will be selected by a panel of five judges: four are industry experts and the fifth judge is YOU, the 3D InCites Community, via the online ballot. The voting begins on February 3 and ends February 13, 2020. Winners will be announced on Friday, February 14, 2020. Awards will be presented in a ceremony during the IMAPS Device Packaging Conference in Fountain Hills, AZ (March 2-5, 2020).

2020 Judges Panel

Jan Vardaman, Techsearch International, Inc.
Jean-Christoph Eloy, Yole Développement
Mike Pineilis, Microtech Ventures, Inc.
Rozalia Beica, 3D Integration Expert