2017 3D InCites Awards

2017 3D InCites Awards

The 3D InCites Awards were established in 2013 to acknowledge companies who were instrumental in bringing interposer and 3D integration technologies to commercialization. Now in its fifth year, the scope of the 2017 3D InCites Awards has been expanded to include significant achievements in heterogeneous integration technology development.

Nominations are open to all who would like to recognize a technology, individual, or company that has made a significant contribution to the advancement of the heterogeneous roadmap including 3D packaging, interposer integration, advanced fan-out wafer level packaging, MEMS and sensors, and full system integration. Winners will be chosen by industry peers, through an online voting process. Submit your nomination here. 

The 2017 3D InCites Awards will be presented in the following categories:

  • Device of the Year
  • Engineer of the Year
  • Process of the Year
  • Foundry of the Year
  • OSAT of the Year
  • Fabless of the Year
  • Startup of the Year
  • Supplier of the Year
  • Research Institute of the Year
  • Lifetime Achievement Award

Sponsorship Opportunities for 2017 3D InCites Awards are available at the Platinum, Silver, and Participant levels. The proceeds from this year’s event will benefit G1ve A Buck Fund, to support its efforts in finding Kid Size Cures™ for childhood cancer. Learn more about G1ve A Buck here.

The 2017 3D InCites Awards will be presented on Wednesday, July 12, 2017, during a ceremony at the Impress Lounge, located above Moscone North, followed by a cocktail reception to benefit G1ve A Buck. Details coming soon.

Nominations open May 4, 2017, and close June 20, 2017. Online voting opens June 22, 2017, and closes July 6, 2017.