SEMICON China 2024

SEMICON China 2024 takes place March 20-22 at the Shanghai New International Expo Centre. This year’s event is expected to draw the attention of the global semiconductor supply chain as the country continues considerable capacity expansion to increase its share of global semiconductor capacity. According to the SEMI Year-End Total Semiconductor Equipment Forecast, China is expected to remain the top destination for semiconductor manufacturing equipment spending through 2025.

With this in mind, SEMI has invited thought leaders from across the globe to address key themes including sustainability, smart manufacturing, heterogenous integration, design, and workforce development.

New this year, and of particular interest to our community is the  Heterogeneous Integration International Conference (HIIC). This session features global leaders from the advanced packaging ecosystem who will share perspectives on the latest HIR technological advancements and emerging trends. Key topics of for the HIIC include:

  • Heterogeneous Integration Roadmap (HIR) 2023 Edition
  • Hybrid bonding, SiP, Chiplet for AI/HPC
  • Advanced packaging materials and equipment
  • Technology and market trends
  • System testing solution

3D InCites members are among the thought leaders presenting throughout the show from the Grand Opening keynotes to the special events.

  • Anirudh Devgan, President & Chief Executive Officer, Cadence Design Systems
    Grand Keynotes, Wednesday, March 20, 14:40–15:05
  • Ingu Yin Chang, SVP of Sales & Marketing, ASE
    Accelerating the AI Economy through Heterogeneous Integration
    HIIC, Tuesday, March 19, 10-10:30
  • Richard Yeoh, Senior Product Marketing Manager, KLA Corporation
    Future Trends in Advanced Wafer-level Packaging and the Impact of Miniaturization on Defect Inspection
    HIIC, Tuesday, March 19, 16:40-17:00
  • Shaun Bowers, Senior Analyst, TechSearch International, Inc.
    Heterogeneous Integration Fuels the Automotive Future
    HIIC, Tuesday, March 19, 17:20 – 17:30
    Elton He, VP, Amkor Technology
    Session Chair, Smart Manufacturing Forum, Thursday, March 21, 13:30-16:40

If you’re attending SEMICON China, we invite you to drop by and say hello to our community members in the Exhibit Hall. Here’s where you’ll find them:

Avery Gerber

Avery Gerber is a 3D InCites Community Intern. Currently pursuing a degree in International Studies…

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