TechSearch International, Inc., Author at 3D InCites

TechSearch International Analysis Predicts Growth for Fan-in WLP and FO-WLP

TechSearch International Analysis Predicts Growth for Fan-in WLP and FO-WLP

TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fan-out WLPs (FO-WLPs).  Despite lower growth for smartphones, growth continues as the number of WLPs per handset increase. WLPs are increasingly adopted in tablets, and wearable devices such as smartwatches, fitness bands, and virtual reality headsets. Fan-in WLPs are projected to grow at an 8.5% CA... »

Heterogeneous Integration Drives New Package Developments

Heterogeneous Integration Drives New Package Developments

The high cost of moving to the next semiconductor technology node is changing the role of packaging and assembly in the electronics industry. Heterogeneous integration has become the solution to achieve the economic advantages that were previously met with silicon scaling. TechSearch International’s new report describes these packaging options, including silicon interposers, fan-out-on-substrate... »

Fan-out Panel Production Becomes a Reality

Fan-out Panel Production Becomes a Reality

Fan-out panel level production is underway at Powertech Technology, Inc. (PTI) for MediaTek’s power management integrated circuit (PMIC) for smartphone applications.  The Samsung Galaxy watch uses the fan-out panel level process (FOPLP) developed by Samsung Electro-Mechanics (SEMCO) to package the application processor and PMIC.  Future applications under consideration for panel production in... »

TechSearch International Explores Power Device Packaging and Assembly Trends

TechSearch International Explores Power Device Packaging and Assembly Trends

Power devices are experiencing growth driven by demand in a variety of areas. TechSearch International projects a 4.3% growth in overall leadframe package shipments from 2017 to 2021 for power device packaging, with stronger growth projected for Cu clip packages. Applications including energy generation and infrastructure, electric and hybrid vehicles, electric vehicle charging, data centers, indu... »

TechSearch International Analyzes Trends in Packages for AI Applications

TechSearch International Analyzes Trends in Packages for AI Applications

Artificial Intelligence (AI) combines both hardware and software.  TechSearch International’s latest analysis explains the packages behind AI applications. AI accelerators found in datacenters require high-density packages to support logic plus high bandwidth memory (HBM). Many silicon interposer designs are in mass production and Intel’s EMIB is also used.  Package-on-package (PoP) is use... »

TechSearch International Analyzes Potential for 3D Sensing Modules

TechSearch International Analyzes Potential for 3D Sensing Modules

Structured light and time of flight (ToF) are the dominant types of 3D sensing used for augmented reality, motion detection, gesture control, automotive/industrial 3D mapping, and proximity applications. These 3D sensing technologies are now appearing in smartphones. Apple’s iPhone X and its Face ID technology was not the first smartphone with a 3D sensing system, but it was the first to have si... »

TechSearch International Analyzes Trends in FO-WLP including Panel Activity

TechSearch International Analyzes Trends in FO-WLP including Panel Activity

While Apple remains the main customer for TSMC’s Integrated Fan-Out WLP (InFO-WLP), an increasing number of companies are adopting a large area version of FO on Substrate. HiSilicon has been in production with ASE’s FOCoS for several years and MediaTek just announced a logic device for networking applications using TSMC’s InFO on Substrate (InFO_oS). TSMC’s FO-WLP platform has been extende... »

TechSearch International Analysis Shows Packaging for Cryptocurrency Provides a Windfall

TechSearch International Analysis Shows Packaging for Cryptocurrency Provides a Windfall

Projections for PC growth are flat and shipments of smartphones show low growth rates. Demand for cryptocurrency devices in flip-chip CSPs and BGAs is expected to provide increased volumes this year to help keep foundries and OSATs busy. Few are willing to add foundry, substrate, or assembly capacity for cryptocurrency because of its unpredictability, but many are enjoying the windfall. Cryptocurr... »

TechSearch International Analyzes New Automotive Packaging Trends

TechSearch International Analyzes New Automotive Packaging Trends

More than 80 companies are developing autonomous vehicles and many more are involved in providing sensors and computational systems for advanced driver assistance systems (ADAS). System design, package choices, materials, and process integration are critical to the successful implementation of the new safety features that are part of ADAS and will ultimately be a part of autonomous driving. ADAS r... »

TechSearch International Forecasts Growth for High-Density FO-WLP and Examines Panel Potential

TechSearch International Forecasts Growth for High-Density FO-WLP and Examines Panel Potential

Growth for high-density fan-out wafer level packages (FO-WLPs) continues unabated, with Apple’s continued use of TSMC’s InFO process in its smartphone application processors. Standard FO-WLP has experienced a few bumps on the road to higher volumes this year. Problems with Qualcomm’s steep ramp of FO-WLP for its PMICs and RF transceivers at the end of last year, and board-level reliability c... »

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