TechSearch International’s teardown of the Apple Watch Series 6 GPS+LTE examined 108 board-level packages plus another 17 packages inside modules and found 27% more wafer level packages (WLPs) than in the previous Series 5, including packages in the wireless charger. Apple used more multi-die modules in the new watch.
X-ray images, shot on equipment provided by Creative Electron, offer a look inside the modules. Details about the die inside were revealed after decapsulation. An increasing number of flip-chip die can be found, along with WLPs and some wire bond parts. Apple’s S6 Application Processor continues to be packaged in TSMC’s InFO fan-out WLP in a package-on-package format. A full deconstruction of the PoP was performed.
- All 38 packages encapsulated in the S6 module extracted in whole
- Construction analysis of fan-out package-on-package (PoP) use for processor and memory
- Cross-sections and laminate substrate metrics
- Metrics for all 156 die in the watch and charger provided
The latest teardown is a 117-page report and an accompanying set of 25 PowerPoint slides gives extra insight into the product.
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