Friday, May 29th from 6:30 am to 8:30 am EST
Advanced electronics across automotive and high-performance computing are evolving rapidly, placing greater demands on board-level reliability and long-term performance. As designs become more complex and operating conditions more demanding, material selection is playing an increasingly important role in enabling consistent performance.
Join Ebad Rehman, Global Product Manager, Solder Paste, MacDermid Alpha Electronics Solutions, for an in-depth webinar exploring how advanced materials support reliability at the interconnect level.
Discover how high-reliability alloys improve solder joint reliability by managing CTE mismatch and mechanical strain under thermal cycling and vibration. The session will also explore how material strategies support increased thermomechanical performance, excellent electrochemical reliability, and durability in high-density, low-standoff designs.
This session is relevant for professionals working on advanced electronic assemblies where long-term performance and reliability are critical.
About the speaker:
Ebad Rehman, Global Product Manager, Solder Paste, MacDermid Alpha Electronics Solutions
Ebad focuses on surface mount technology materials for high-reliability automotive, communications, and computing applications, with an emphasis on thermomechanical performance and low-temperature assembly solutions. He holds a Bachelor’s degree in Electrical Engineering and a Master’s degree in Technology Management. He has been with MacDermid Alpha for more than five years and has spearheaded multiple product development initiatives.
