SEMI

SEMI’s Strategic Materials Conference Calls for Supply Chain Cooperation

SEMI’s Strategic Materials Conference Calls for Supply Chain Cooperation

The message remains consistent: following Moore’s Law is no longer economical for most IC designs. A major part of the IC value creation is moving from the die to the IC package. Now advanced packaging technologies and materials enable combining multiple dies with heterogeneous functions as well as high-quality passives into one package. This integration increases performance, while significantl... »

SEMICON West 2018: Smart Starts Where?

SEMICON West 2018: Smart Starts Where?

Well, that was interesting. SEMICON West 2018 just wrapped up, and I’m not quite sure what just happened. This year’s event was… for lack of a better word… different. All I could think of as I looked around the Moscone Center upon arrival was “ready or not, SEMICON West 2018 is here, emphasis on ‘or not.’” While I generally endeavor to paint a rosy picture, I have to remember that ... »

SEMI Alliance

Strategic Partnership with ESD Alliance Extends SEMI’s Reach to Semiconductor Design

On Monday, April 16, 2018, SEMI, the industry association representing the global electronics manufacturing supply chain, and the Electronic System Design (ESD) Alliance, representing the design community, announced a strategic partnership. On Tuesday I had a very informative conference call with Bettina Weiss, VP Business Development at SEMI and Bob Smith, Executive Director, the ESD Alliance to ... »

Packaging, Innovation, and Our Application-Driven World

Packaging, Innovation, and Our Application-Driven World

MEPTEC lunches, now known as the MEPTEC / IMAPS / SEMI Semiconductor Speaker Series Luncheon sponsored by Chip Scale Review, are on again in Silicon Valley. At the most recent lunch  in mid-March 2018, I was pleased to see that it was none other than Rich Rice, VP Business Development, ASE US, delivering his view on Packaging Innovation for our Application-Driven World Rich’s thesis: that, desp... »

Citius, Altius, Fortius: Packaging Topics at SEMICON Korea 2018

Citius, Altius, Fortius: Packaging Topics at SEMICON Korea 2018

Winter 2018, and Korea is at the center of the world in both sports and in electronics. Sports, of course, because of PyeongChang, host city for the 23rd Olympic Winter Games, with participants ranging from Eritrea to Tonga, along with the usual cold-weather-country (Norway, Canada, Sweden, etc.) players who showed up for the Games. And electronics, of course, specifically semiconductor device fab... »

Notes from SEMI’s ISS 2018, Days 2 and 3

Notes from SEMI’s ISS 2018, Days 2 and 3

The remaining two days of SEMI’s ISS 2018 dawned foggy and damp, making it a heck of a lot easier to head to the ballroom for a day and half full of inspiring talks versus ditching it all to answer the call of the pounding surf (I grew up on the ocean and now live in the desert, so trust me when I say the temptation was real.) Day Two started with a general technology session kicked off by L... »

New SEMI Japan President to Drive SEMI 2.0 in Japan

New SEMI Japan President to Drive SEMI 2.0 in Japan

SEMI today announced the appointment of Masahiko (Jim) Hamajima as president of SEMI Japan. Reporting to SEMI president and CEO Ajit Manocha, Hamajima assumes profit and loss (P&L) responsibility for SEMI Japan and leadership of SEMICON Japan along with all regional programs, events, and initiatives including SEMI Standards and industry advocacy. With more than 325 members, SEMI Japan plays a ... »

Continental Drifts or Tectonic Shifts? Advanced Packaging 2017

Continental Drifts or Tectonic Shifts? Advanced Packaging 2017

That’s great it starts with an earthquake … R.E.M. Boxing Day 2017 ended with an earthquake in Silicon Valley, at 10:32 pm, a magnitude 3.9 temblor near Alum Rock I thought could have been my neighbor dropping something heavy in the apartment upstairs, except that nobody lifts and drops anything that heavy, for that long, in the building where I live. No reports of damage, but the shaking came... »

SEMICON Europa 2017: Connect, Collaborate, Innovate, Grow and Prosper

SEMICON Europa 2017: Connect, Collaborate, Innovate, Grow and Prosper

I remember the day I became Queen of 3D like it was yesterday: It was 2007 and I was attending my very first SEMICON Europa, which was held in Stuttgart, Germany. At the time, I was managing editor of Advanced Packaging Magazine, and the hot technology topic was through silicon vias (TSVs) as an emerging technology that would enable 3D chip stacking. Equipment suppliers like SPTS (then STS), EV Gr... »

Smart Factories: Is the Semiconductor Industry Practicing What it Preaches?

Smart Factories: Is the Semiconductor Industry Practicing What it Preaches?

I’ve often found it somewhat ironic that those responsible for dreaming up and building the technologies that made smart devices, cities, cars, and factories possible, are often the slowest to adopt them. So it was with great interest that I listened to Guillermo Novo’s keynote at a recent SEMI Arizona Breakfast Forum, which kicked off a morning of presentations focused on smart manufacturing,... »

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