April 2025 marked a dynamic month for the semiconductor industry, with major developments across technology, sustainability, and global collaboration. Companies announced new partnerships, facility expansions, product innovations, and industry recognitions, reflecting strong momentum and strategic growth. From keynotes at international conferences to advancements in manufacturing and packaging, the month underscored the sector’s continued drive toward a more connected and sustainable future.
Technology & Innovation
ASE demonstrated co-packaged optics (CPO) technology that reportedly improves energy efficiency for AI applications. The CPO design integrates multiple optical engines onto a single substrate, with intention to reduce power consumption and enhance bandwidth for data centers. This innovation offers a potential solution to improve scalability, reduce latency, and optimize data throughput for next-generation networking and compute systems.
EV Group attended this year’s CS International and PIC International conference in Brussels. The company shared insights on leveraging nanoimprint lithography for microLED lens packaging and discussed the future role of bonding in photonic integrated circuits and co-packaged optics.
StratEdge Corporation showcased its molded ceramic packages designed for high-frequency chips up to 18 GHz at the IMAPS HiTEC Power Packaging Conference (April 14-17) and the Components for Military & Space Electronics (CMSE) event (April 29-May 1). These packages reportedly offer robust thermal dissipation and are built for reliability in extreme conditions, with the intention of making them suitable for applications in automotive, aerospace, and defense sectors.
Indium Corporation, at PCIM Europe 2025, showcased its advanced materials solutions for power electronics, emphasizing sustainability and high-reliability performance. The company highlighted its Fluxless Assembly Solder Technology (FAST), Pb-free innovations like Durafuse® HT and Indalloy® 301LT, and die-attach solutions such as InFORCE® pressure sinter pastes and InFORMS® reinforced solder performs. These offerings aim to enhance thermal reliability and support energy-efficiency technologies in power device packaging.
Evatec AG’s Technology Development team achieved a milestone in Plasma Enhanced Atomic Layer Deposition (PEALD), demonstrating highly conformal Al₂O₃ coatings on structured wafers with aspect ratios up to 4:1. The development supports expanded capabilities in thin film technologies for applications across power devices, MEMs, photonics, advanced packaging, and 3D logic and memory.
At the 2025 Critical Materials Council Conference in Austin, Brewer Science presented advancements in temporary bonding materials for chiplet integration. The company’s BrewerBOND® VersaLayer System aims to optimize temporary bonding and debonding processes, potentially offering scalable solutions for thin die handling and advanced packaging applications such as die-to-wafer hybrid bonding and fan-out wafer-level packaging.
Collaborations & Acquisitions
LPKF and Electronics SE announced a partnership with Performance Technologies Group, Inc. (PTG) to represent its products in the Northeastern United States. The collaboration adds laser paneling and SMT stencil equipment to PTG’s existing electronic industry offerings.
Mycronic’s Global Technologies division acquired UK-based RoBAT, a provider of high-frequency signal quality test equipment for bare board PCBs. RoBAT’s technology is expected to enhance Mycronic’s PCB test offerings, particularly for AI server applications. The acquisition aims to strengthen Mycronic’s capabilities in addressing the demands of high-speed communication and computational power.
SEMI CEO, Ajit Manocha, met with key European leaders in Brussels to advance collaboration on Europe’s semiconductor strategy earlier this month. Key meetings included visits to Dutch Parliament, a discussion with ASML CEO Christophe Foquet, and meetings with Roberto Viola of DG CONNECT and Henna Cirkkunen of the European Commission. Manocha also participated in the SEMI Europe Advisory Board meeting at imec. The visit focused on the European Chips Act 2.0.
Expansion & Development
Kuehne+Nagel announced the opening of a 432,000 sw. Ft. facility in Laredo, Texas, intended to support increased demand for nearshoring logistics at the U.S.-Mexico border. The Site consolidates three previous warehouses and includes 200 trailer stalls, 115 dock doors, and cross-docking and storage capabilities, with full operations scheduled by mid-April 2025.
Multibeam Corporation announced the establishment of a new sales office in Japan during a keynote at Photomask Japan in Yokohama. This expansion aims to meet the growing global demand for its E-Beam Lithography (EBL) production systems, which offer high-resolution, maskless lithography with over 100 times the throughput of conventional systems. The move reportedly positions Multibeam to better serve local customers and strengthen its presence in Japan’s advanced semiconductor ecosystem.
ERS Electronic GmbH announced the opening of the ERS Barbing Competence Center, with a focus on advancing Advanced Packaging technologies. Located in Europe, the center’s establishment is seen as a strategic move to enhance the region’s semiconductor ecosystem.
Awards & Recognition
ASE Global’s 2024 Best Supplier Awards in Kaohsiung recognized 17 partners for their excellence, with a focus on ESG criteria. Notable initiatives included a joint energy efficiency project and carbon inventory contributions, supporting ASE’s NetZero 2050 goals. The event emphasized the importance of strategic partnerships in driving sustainable growth and competitiveness.
Indium Corporation received two CIRCUITS ASSEMBLY New Product Introduction (NPI) Awards for its high-reliability solder materials. The Durafuse® HR alloy reportedly enhances thermal cycling performance and reduced voiding, making it suitable for automotive electronics. The CW-807RS flux-cored wire offers fast wetting speeds and minimal spattering, ensuring cleaner soldering processes.
Brewer Science achieved GreenCircle Certified Zero Waste to Landfill status for the tenth consecutive year. The company remains the only semiconductor industry member with this certification, highlighting its commitment to sustainability. Brewer Science diverts all waste from landfills through recycling, reuse, and composting. The company aims for net-zero carbon emissions by 2025 and has set goals to reduce its greenhouse gas emissions by 80% by 2030 and use 100% renewable energy annually.
Evatec AG marked its 10th anniversary at the Trubbach site, drawing 1,300 visitors. The event featured company tours, activities for children, and outdoor refreshments. The work of Evatec was highlighted with volunteers on sight to provide insights in the company’s daily operations. The celebration was described as a great success.
PDF Solution’s Ranjan Chatterjee, Vice President of Smart Manufacturing Solutions, was re-elected to the INEMI Board of Directors. As he had served since 2020, he also co-chairs INEMI’s Smart Manufacturing initiatives, contributing to roadmap development and project planning in Industry 4.0 and IIoT.
Indium Corporation recently hosted Daylight Blue Media group to film a spotlight video featuring Dr. Yan Liu, Director of Global Research and Development, who was named this year’s Innovator of the Year. The video will be shown during the 112th Annual celebration of Manufacturing, scheduled for May 22 at SRC Arena & Events Center.
Industry Events
EV Group’s Justin Yun spoke at TheElec’s “Advanced Packaging Hot Issues Conference” in South Korea. The conference, attended by approximately 100 industry professionals, focused on topics like glass substrate interposers and thermal management. Yun shared insights on technology trends with his presentation.
Onto Innovation participated in the 2025 CS International Conference in Brussels, Belgium (April 7-9), where the presentation “High Sensitivity & Throughput Defect Inspection Technologies for SiC and GaN Power Technologies” was delivered. The session addressed challenges in producing SiC and GaN-based devices at larger wafer sizes and examined inspection solutions, including the Celero™ PL system, which was described as supporting subsurface defect detection and classification for both R&D and high-volume production environments.
SurplusGLOBAL hosted the Legacy Networking Party in Shanghai, bringing together customers, partners, and industry peers aboard a yacht on the Huangpu River. The event was positioned as an opportunity to strengthen connections and reflect on shared contributions to the semiconductor legacy supply chain.
SEMI hosted the inaugural SEMIEXPO from April 1-2 at the India Convention Center in Indianapolis. The event brought together over 1,100 attendees and 50 exhibitors to focus on smart manufacturing and smart mobility, highlighting the Midwest’s growing role in the global semiconductor ecosystem. Keynotes and panels emphasized cross-sector collaboration and workforce development to meet the industry’s projected demand for 350,000 new U.S. jobs by 2030.
IMAPS co-hosted the 2025 ICEP-IAAC Conference, held April 15-19 in Nagano, Japan. As Japan’s largest international conference on electronic packaging, ICEP-IAAC brought together over 360 participants and featured more than 35 technical sessions. The event covered key areas such as advanced packaging, materials, reliability, and thermal management, and served as a global platform for innovation and collaboration in packaging technologies.
IMAPS’s Advanced Packaging for Power Electronics (APPE) Conference was held April 14-17, 2025, in Albuquerque, New Mexico. The event brought together experts in power semiconductor packaging, reliability, thermal management, and advanced materials to support the next generation of power electronics development.
Semilab was listed as a Gold Sponsor of the 48th International Spring Seminar on Electronics Technology (ISSE), which is scheduled to take place May 14-18, 2025, in Budapest, Hungary. The event is positioned to bring together professionals and researchers in electronics manufacturing and packaging. A presentation from Semilab is also planned during the seminar.
Amkor Technology and the SEMI Arizona chapter hosted the SEMI Arizona Breakfast Forum at the Arizona Commerce Authority in Phoenix. David McCann from Amkor presented on Arizona’s leadership in semiconductor supply chain development, followed by a discussion on next-generation semiconductor development.
Workforce Development
The upcoming 75th IEEE Electronic Components and Technology Conference (ECTC), that will take place May 27-30 in Dallas, will spotlight student engagement through new initiatives, including local outreach, volunteer opportunities, and a student competition focused on thermal performance and reliability. These programs aim to foster early interest and involvement in microelectronics packaging.
ACM Research sponsored team SHOCKWAVE from Glencoe High School in Oregon for this year’s first Robotics Competition, a global event where high school teams design and build robots for various tasks. The sponsorship highlights support for hands-on learning and mentorship, aimed at developing future engineers.
SEMI concluded the final day of its Workforce Development Pavilion with sessions highlighting career paths from professionals at ASML, Brewer Science, and Synopsys, alongside resume and interview workshops.
Amkor Technology participated in the April Workforce Development Breakfast hosted by WESTMARC Foundation. Scott Holman, VP of HR at Amkor Arizona, joined a panel with various industry professionals to discuss workforce strategies and the future of talent in Arizona’s tech sector. The event focused on building strong industry-education partnerships to support the region’s growing workforce needs.
Career Advancements and Opportunities
PLANOPTIK recently appointed Jonas Discher as Head of Sales for Wafer Level Packaging and Advanced Packaging. With a background in technical sales and strategic business development, Disher brings industry insight and leadership experience to support PLANOPTIK’s growth in the packaging market.
Onto Innovation is hiring for several open positions
- Senior Mechanical Engineer in Budd Lake, NJ. Those interested can apply here.
- Electrical Engineer in Budd Lake, NJ. Those interested can apply here.
- Staff Systems Engineer in Budd Lake, NJ. Those interested can apply here.
- Principal Systems Engineer in Budd Lake, NJ. Those interested can apply here.
- Director of Systems Engineering in Hillsboro, OR. Those interested can apply here.
Yield Engineering Systems is hiring for a Senior Product Manager position based in Bangaluru, Karnataka. Those interested can apply here.
Veeco is hiring for a Mechanical Engineer of Fluidics to join their team in Horsham, PA. Those interested can apply here.
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