ERS has been supplying innovative thermal test solutions to the semiconductor industry since 1970 and is famous for fast-ramping and precise low-noise thermal systems (-65°C to +400°C) for analytical, parametric and wafer sort probing up to 300mm. The patented ERS flagship product for hot/cold wafer test, AC3(R), is available for package-level tri-temp applications for MEMS test. Today, our thermal chuck systems such as AC3, AirCool® PRIME, AirCool®, and PowerSense® are integral components in all larger-sized wafer probers across the semiconductor industry.
We design and build stand-alone thermal-forcing systems and custom production tools for difficult thermal applications – we welcome new challenges from customers and strive to meet their demands through rigorous research and innovation.
We also supply the advanced wafer-level packaging market with its fully automatic, as well as manual, debonders and warpage adjust tools used in the production of both 200mm and 300mm eWLB device packages. On a broader scale, ERS supports not only eWLB but many other Fan-Out Wafer-Level-Packaging (FOWLP) and Panel-Level-Packaging (FOPLP) technologies. Ours headquarter, sales department, engineering center, and production facilities are in the Munich suburb of Germering, and we also have support offices in the US, China, Singapore, and Taiwan. Visit https://www.ers-gmbh.com/ for more information.
Mar 11, 2021
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Oct 08, 2020