Rudolph Technologies, Author at 3D InCites

Rudolph Technologies Introduces New JetStep Lithography Systems at SEMICON China 2019

Rudolph Technologies Introduces New JetStep Lithography Systems at SEMICON China 2019

Rudolph Technologies, Inc. (NYSE: RTEC) today announced the immediate availability of its new JetStep® lithography systems for advanced packaging processes on wafer and panel formats. The JetStep systems incorporate an option for a new, proprietary submicron lens design, as well as up to 25% increased productivity over the previous JetStep systems. The JetStep wafer stepper will also feature a 20... »

Rudolph Technologies Receives Orders for Over $15 Million from Major Memory Manufacturer

Wilmington, Mass. (January 15, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received orders for over $15 million of legacy and new process control systems from a memory manufacturer based in Asia. The systems will be used by a top-tier memory chip maker as they rapidly transition high-end DRAM (DDR4, DDR5) and HBM DRAM packaging from wire bonding to advanced packagi... »

Rudolph Technologies Announces Rapid Adoption of the Dragonfly G2 System for Advanced Packaging Inspection

Rudolph Technologies Announces Rapid Adoption of the Dragonfly G2 System for Advanced Packaging Inspection

 Wilmington, Mass. (January 8, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received orders for 12 of its Dragonfly™ G2 system, just months after releasing the product. Several systems were delivered in the fourth quarter to the largest OSAT where the Dragonfly G2 systems displaced incumbent 3D technology and retained the Company’s market leadership in 2D ma... »

Rudolph’s NovusEdge Selected by Leading Wafer Manufacturers for Bare Wafer Edge and Backside Inspection

Rudolph’s NovusEdge Selected by Leading Wafer Manufacturers for Bare Wafer Edge and Backside Inspection

Wilmington, Mass. (12/11/2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced the receipt of over $12M in new orders for its recently-released NovusEdge™ system for edge and backside inspection on bare silicon wafers. The new orders are for capacity expansions at our existing customers as well as orders from two additional large wafer manufacturers based in Asia. These orders are in... »

Rudolph Technologies Releases NovusEdge System for Edge, Notch and Backside Inspection of Unpatterned Wafers

Rudolph Technologies Releases NovusEdge System for Edge, Notch and Backside Inspection of Unpatterned Wafers

Wilmington, Mass. (November 1, 2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced the availability of its NovusEdge™ system for edge, notch and backside inspection of unpatterned wafers. The company plans to ship multiple systems totaling more than $3M by year end to fill existing orders from two customers. The new system is the result of a multi-year collaboration with bare wafer ... »

Rudolph Technologies Launches Second-Generation Dragonfly Inspection and Metrology System for Advanced Packaging

Rudolph Technologies Launches Second-Generation Dragonfly Inspection and Metrology System for Advanced Packaging

Wilmington, Mass. (August 29, 2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced its new Dragonfly™ G2 platform, which incorporates many of the benefits of the Firefly™ system onto the Dragonfly platform, including higher sensitivity and throughput and the proprietary Clearfind™ Technology. The new system increases the options for advanced packaging customers to meet their wafe... »

Rudolph Technologies Expands Memory Customer Base with  $21 Million in System Orders

Rudolph Technologies Expands Memory Customer Base with $21 Million in System Orders

Wilmington, Mass. (January 16, 2018)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received over $21 million (USD) in orders for process control solutions for memory applications from two customers: a Korean-based manufacturer of advanced DRAM ranking in the top five of worldwide semiconductor companies and a rapidly expanding 3D NAND manufacturer in China. The orders, whic... »

Rudolph Announces Multiple Customers’ Acceptance  of its Firefly Inspection System

Rudolph Announces Multiple Customers’ Acceptance of its Firefly Inspection System

Wilmington, Mass. (September 12, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that its Firefly™ Inspection Systems, shipped to fulfill previously announced orders from multiple semiconductor manufacturers, are now qualified for production. The Firefly Inspection Systems provide high-resolution visual and non-visual inspection in a variety of advanced packaging processes, inclu... »

Rudolph Technologies Launches New Truebump Technology at SEMICON Taiwan 2017

Rudolph Technologies Launches New Truebump Technology at SEMICON Taiwan 2017

Wilmington, Mass. (September 11, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announces new Truebump™ Technology on the Dragonfly™ Inspection System. Truebump Technology provides fast, accurate and repeatable three-dimensional (3D) metrology for all advanced packaging bumping applications, from copper (Cu) pillar, to micro-bumps, and even large C4 bumps. With the Dragonfly system, the advan... »

Rudolph JetStep S Lithography System Advances Panel-based Advanced Packaging

Rudolph JetStep S Lithography System Advances Panel-based Advanced Packaging

Wilmington, Mass. (May 23, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received an order for its JetStep S Lithography System for fan-out panel-based advanced packaging processes. The system, which will ship in June 2017 to an outsourced assembly and test (OSAT) facility based in Asia, will be used to produce system-in-package (SiP) products that combine sensor, pro... »

Page 1 of 41234