EV Group

3D Integration Enables More than Moore Technologies

3D Integration Enables More than Moore Technologies

Looking back at the last 10 years, it is very difficult to choose one single event that was the most pivotal for commercializing 3D integration technology. There have been many prior events that have driven 3D integration and aligned the whole industry in migrating from monolithic 2D to heterogeneous and 3D integration. From my perspective, the most path-breaking event was the rise of the backside... »

EV Group Accelerates 3D-IC Packaging Roadmap with Breakthrough Wafer Bonding Technology

EV Group Accelerates 3D-IC Packaging Roadmap with Breakthrough Wafer Bonding Technology

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the new SmartView® NT3 aligner, which is available on the company’s industry benchmark GEMINI® FB XT integrated fusion bonding system for high-volume manufacturing (HVM) applications. Developed specifically for fusion and hybrid wafer bonding, the... »

EV Group Earns Sixth Consecutive Triple Crown Win in VLSIresearch 2018 Customer Satisfaction Survey

EV Group Earns Sixth Consecutive Triple Crown Win in VLSIresearch 2018 Customer Satisfaction Survey

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that customers have once again voted the company one of the 10 BEST Focused Suppliers of Chip Making Equipment and one of the BEST Suppliers of Fab Equipment in the 2018 VLSIresearch Customer Satisfaction Survey, increasing its score in both award s... »

EV Group and IBM Sign License Agreement on Laser Debonding Technology

EV Group and IBM Sign License Agreement on Laser Debonding Technology

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and IBM (NYSE: IBM) today announced that the companies agreed to sign a license agreement on laser debonding technology. EVG plans to integrate IBM’s patented Hybrid Laser Release process into EVG’s advanced, field-proven temporary bonding and debonding equipmen... »

EV Group Completes Latest Phase of Production Capacity Expansion at Corporate HQ

EV Group Completes Latest Phase of Production Capacity Expansion at Corporate HQ

  EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has completed construction and opened a new building at its corporate headquarters in Austria to expand capacity for producing its industry-leading process equipment. The building, part of an investment of more than 20 million Euros th... »

EV Group and SwissLitho to Develop Joint Nanoimprint Lithography Solution for 3D Optical Structures with Single-Nanometer Accuracy

EV Group and SwissLitho to Develop Joint Nanoimprint Lithography Solution for 3D Optical Structures with Single-Nanometer Accuracy

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and SwissLitho AG, a manufacturer of novel nanolithography tools, today announced a joint solution to enable the production of 3D structures down to the single-nanometer scale. Initially demonstrated within the “Single Nanometer Manufacturing for Beyond CMOS Devic... »

EV Group Receives Multiple Lithography and Metrology System Orders for Wafer-Level Optics Manufacturing

EV Group Receives Multiple Lithography and Metrology System Orders for Wafer-Level Optics Manufacturing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received multiple orders for its comprehensive portfolio of manufacturing equipment and services designed to address the burgeoning demand for wafer-level optics (WLO) and 3D sensing. The market-leading portfolio comprises the EVG®770 automat... »

EV Group Celebrates 20 Years of Supporting Micro- and Nano-Technology Development in Japan

EV Group Celebrates 20 Years of Supporting Micro- and Nano-Technology Development in Japan

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is celebrating the 20th anniversary of its wholly owned subsidiary in Japan, EV Group Japan KK. Established in August 1997 in Yokohama, EV Group Japan has since expanded its presence to include offices in Fukuoka and a state-of-the-art applic... »

The Brighter Side of SEMICON West 2017

The Brighter Side of SEMICON West 2017

Generally, I avoid reading other journalists’ coverage of events I’ve attended until I’ve had a chance to finish my own coverage. But there it was in my inbox in a recent edition of Semiconductor Packaging News: “Five Takeaways from Semicon” by Semi Engineering’s Mark LePedus. I couldn’t resist. I had to click. I must admit, Mark is more of a hardcore technology journalist than I am,... »

EV Group Unveils Breakthrough Low-Temp Laser Debonding for FOWLP

EV Group Unveils Breakthrough Low-Temp Laser Debonding for FOWLP

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its next-generation laser debonding solution, which enables high-throughput, low-cost-of-ownership (CoO) room-temperature debonding for ultra-thin and stacked fan-out packages. Designed as a module for integration in the company’s benchmark EVG®850... »

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