EVG®40 NT2 offers breakthrough metrology performance to accelerate implementation of wafer- and die-level hybrid bonding and maskless lithography FLORIAN, Austria,...
SEMICON Europa is back! On the agenda? The latest innovations and smart applications powering the next wave of semiconductor industry...
WIESELBURG, Austria, August 25, 2021—Together with research partners Silicon Austrian Labs, Evatec, EV Group and TDK Electronics, ZKW is working...
EVG S&R Mastering Shop™ further lowers barriers to adoption of nanoimprint lithography for wafer-level and panel-level production applications such as...
EVG®770 NT enables large-area master stamp fabrication of complex micro- and nano-structures for augmented reality waveguides, wafer-level optics and advanced...
Over the past month, you may have noticed a new addition to the 3D InCites platform. The 3D InCites Podcast...
For the second time in its 71-year history, ECTC will be presented as a virtual conference, opening Tuesday, June 1,...
The semiconductor industry is currently undergoing the most radical change in its history. Many new applications such as artificial intelligence...
YES EcoCoat™ to be installed at EVG’s NILPhotonics® Competence Center in Austria FREMONT, Calif. – Apr 19, 2021YES (Yield Engineering...
We took our annual mural project online this year! Illustrator Ronna Encarnacion created this original watercolor to reflect the importance...
For the last several years, we held the 3D InCites Mural Project, in conjunction with the 3D InCites Awards, in...
SEMICON China attracts the world’s leading technology companies who design, develop, manufacture, and supply the technologies to manufacture the microelectronics...
On Definitions and Buzzwords Long-time readers of IFTLE know that I’m sensitive about nomenclature and buzzwords. For instance: “nanotechnology” and...
While most of SEMI’s global events went virtual in 2020, SEMICON Europa was straight-up canceled. While I was disappointed, since...
Joint Development Program will offer highly configurable, ultra-precision end-to-end hybrid bonding solutions to suit various applications, with optimal line balancing...
EVG Academy doubles the amount of training space and technical trainers; provides training on every class of EVG equipment and...
Virtual IWLPC kicks off on October 13, 2020, and 3D InCites community members will be well represented, from the panel...
Newly opened Cleanroom V building nearly doubles cleanroom capacity and strengthens capabilities of EVG’s NILPhotonics® and Heterogeneous Integration Competence Centers...
EVG achieves ranking among THE BEST Suppliers to Foundation Chip Makers for the first time in survey results; continues win...
If you’ve attended the IMAPS Device Packaging Conference over the past three years, you probably noticed a hand-drawn mural coming...