Latest Posts - Page 3
Making Connections at SEMICON Europa 2022
What a week! From keynotes, panel discussions, and podcast interviews, to booth parties and after-hours networking – the week at...
SEMICON Europa 2022 Member Preview
SEMICON Europa kicks off next week as microelectronics experts and visionaries gather for insights into advanced technologies that are driving...
EV Group Advances Leadership in Optical Lithography With Next-Generation EVG150 Resist Processing Platform
ST. FLORIAN, Austria, November 7, 2022—EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS,...
Community Member Monthly Highlights – October
Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth...
The Power of Community at the IMAPS International Symposium
One of the things I love most about being part of the International Microelectronics and Packaging Society (IMAPS) is the...
Community Member Monthly Highlights – September
Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth...
EV Group Revolutionizes 3D Integration from Advanced Packaging to Transistor Scaling with NanoCleave Layer Release Technology
IR laser cleave technology enables nanometer-precision layer transfer through silicon, eliminating glass substrates for advanced packaging and enabling thin-layer 3D...
EV Group Expands Collaboration with ITRI on Heterogeneous Integration Process Development
ST. FLORIAN, Austria, August 30, 2022—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS,...
Maskless Lithography Addresses Shift Toward Heterogeneous Integration and 3D Packaging
Moving from 2D scaling to heterogeneous integration and 3D packaging is ever-more critical to improving semiconductor device performance. In recent...
SEMICON West 2022: 3D InCites Member Company Preview
Sustainability, smart technologies, and workforce development will take center stage at SEMICON West 2022 Hybrid, July 12-14 at the Moscone...
What I Learned At ECTC 2022
I’ve started so many event blog posts since the return of live events with the phrase – it’s good to...
ECTC 2022 Member Preview — Stacked and Packed
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components...
2022 IMAPS DPC: Back and Better Than Ever
After two years of virtual conferences, it was great to be back in person last week at the 2022 IMAPS...
IMAPS DPC 2022: Community Member Preview – Keynotes, Technical Tracks and More
IMAPS Device Packaging Conference 2022 takes place next week – March 8-10, here in our home state of Arizona, and...
Another Strong Year Ahead for Hybrid Bonding Thanks to Heterogeneous Integration
While the COVID-19 pandemic has continued to cause mass disruption to the global economy during the past year, one notable...EV Group Recognized by Bosch as a Preferred Supplier of Semiconductor Equipment
EVG is the first semiconductor equipment supplier ever to receive Preferred Supplier status EV Group (EVG), a leading supplier of...
Everything You Need to Know About Nominating Your Company for the 2022 3D InCites Awards
Get ready! The 2022 3D InCites Awards nominations are open! This year, we are excited to partner with the International...
New Multi-Functional Micro- and Nanoimprint Solution from EV Group Offers Unprecedented Flexibility for High-Volume Optical Device Manufacturing
ST. FLORIAN, Austria, January 18, 2022—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS,...
