Latest Posts - Page 2
EV Group: More than 40 Years of Growth Fueled by 3D/Heterogeneous Integration
Riding the 3D/Heterogeneous Integration Wave For decades, the ability to achieve the necessary power, performance, area, and cost (PPAC) in...
SEMICON China 2024 Community Member Preview
SEMICON China 2024 takes place March 20-22 at the Shanghai New International Expo Centre. This year’s event is expected to...
January Member Achievements, New Hires and Grand Openings
Members of the 3D InCites community hit the year running by celebrating milestones, new hires, promotions, and grand openings. Here...
EV Group Brings Revolutionary Layer Transfer Technology to High-volume Manufacturing with EVG®850 NanoCleave™ System
Infrared laser cleave technology enables ultra-thin-layer transfer from silicon substrates with nanometer precision, revolutionizing 3D integration for advanced packaging and...
EV Group Completes Construction of New Manufacturing V Building at Corporate Headquarters to Expand Production Capacity
Company expansion driven by market growth in 3D/heterogeneous integration fueling strong demand for EVG hybrid bonding and other leading process...
Silicon Austria Labs and EV Group Strengthen Collaboration in Optical Technology Research
Expanded collaboration includes installation of EVG’s LITHOSCALE® maskless exposure system, EVG®7300 UV-NIL system and complementary resist processing systems FLORIAN /...
SEMICON Europa 2023 Community Member Preview
SEMICON Europa 2023, co-located with productronica in Munich, Germany makes for one of the strongest single events for electronics manufacturing...
Community Member Monthly News – August 2023
News you may not have seen this month from our community members. Along with some upcoming participation to keep an...
EV Group Hybrid Bonding and Nanoimprint Lithography Solutions to be Highlighted at SEMICON Taiwan 2023
Papers to highlight breakthrough capabilities of EVG’s hybrid bonding and metrology solutions for heterogeneous integration, and NIL solutions for meta-optics...
SEMICON Taiwan – Community Member Preview
SEMICON Taiwan is arguably the most influential semiconductor event in Taiwan, reaching records high in terms of scale in its...
SEMICON West 2023 Member Preview
SEMICON West 2023 is taking aim at Building a Path Forward with a reimagined exhibition and conference as industry experts and visionaries...
3D InCites Community Member Monthly Highlights — June
Our 3D InCites Community Members had an abundant amount of news to share this month, so we thought we should...
EV Group Scores Big with Eleventh Consecutive Triple Crown Win in TechInsights 2023 Customer Satisfaction Survey
EVG achieves its highest rankings ever with 5 Star ratings across all applicable award categories; continues winning streak with 21st...
SEMI 3D & Systems Summit Community Member Preview
SEMI 3D & Systems Summit to Spotlight Latest Trends in Heterogeneous Integration, Hybrid Bonding, Chiplet Design and Photonics Leading experts...
ECTC 2023: Quantum Computing, Hybrid Bonding, and the CHIPS for America Act
With over 350 papers in 36 oral sessions and 5 interactive presentations, there was no shortage of content to absorb...
2023 ECTC Community Member Preview
Wow, wow, wow, 3D InCites community members are going to be well represented at next week’s Electronics Components Technology Conference...
Wafer Bonding and NanoCleave: The New Lithography Scaling
NanoCleave enables Laser Debonding on Silicon with Nanometer Precision In semiconductor manufacturing, 3D integration – the manufacturing, vertical assembly, and...
IMAPS DPC Community Member Preview
The 19th Annual Device Packaging Conference (DPC 2023) is scheduled for next week, March 13-16, 2023, at the WeKoPa Conference...
