Latest Posts - Page 7
Bumps are the Elephant in the Wafer Stress Room: NCCAVS Joint User Group Meeting On 3D Packaging
The Northern California Chapter of the America Vacuum Society has, for years, run a very strong program of ongoing User...
EV Group: EVG850TB/DB XT
Product Description The EVG850TB/DB XT temporary bonding/debonding platform addresses the high volume manufacturing needs for thin wafer processing. Nine process... EV Group and Dynaloy Jointly Develop Complete Single-Wafer Cleaning Solution for 3D-IC/TSV, Advanced Packaging, MEMS and Compound Semiconductor Applications
CoatsClean™ combines process, equipment and formulation technology to deliver innovative, low cost-of-ownership approach to single-wafer photoresist and residue removal ST....
European 3D TSV Summit: Focus on Cost of Ownership
Now that the “technology bricks” for building 2.5D devices and 3D ICs have been essentially qualified, the focus has turned...Following the 3D innovation path to profitability
In last week’s email update, I talked about the pendulum starting to swing back the other way, albeit ever so...EV Group Completes Cleanroom Expansion, Opens New R&D Labs And Customer Training Center At Corporate Headquarters
EV Group (EVG) supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced the completion...And Now, a Word for Our Sponsors
While there’s no denying that our registered members, guest bloggers, forum panelists, advisory board, and regular readers are all vital...EV Group,Triple I at Work: The Sequel
Two years ago, I visited EV Group’s world headquarters in Schärding, Austria, and wrote about what they call their Triple...Things are humming along at EV Group
“Keeping busy” doesn’t begin to describe what’s happening at EV Group these days. I sat down with Markus Wimplinger, Corporate...
Thermocompression Bonding for Microbump Flip Chip Soldering
An excerpt from the Semiconductor Assembly Blog by Andy C. Mackie, Global Product Manager for Indium Corporation's Semiconductor and Advanced...The SEMICON West Reception Crawl
Yes, there were lots of great conference sessions, keynotes, and products and technologies being showcased at SEMICON West 2011 (I...EV Group Boosts High-Volume Manufacturing Performance Across Product Lines With New XT Frame Equipment Platform
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...3D Integration Research, SEMATECH Style
SEMATECH’s story is one that is truly built upon the essence of collaboration. SEMATECH is not a traditional research center. ...Willkommen in Österreich!
Note to self: when visiting a class 10 clean room that requires full...