EV Group, Author at 3D InCites

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EV Group Partners with NSI to Enable First Wafer-level Heterogeneous Integration of GaAs on Silicon for RF Front-end Module Manufacturing

EV Group Partners with NSI to Enable First Wafer-level Heterogeneous Integration of GaAs on Silicon for RF Front-end Module Manufacturing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, today announced that it has partnered with Ningbo Semiconductor International Corporation (NSI), a specialty semiconductor foundry based in Ningbo, China, in the development of the industry’s first process technology platform for wafer-level heterogeneous integration of gallium arsenide (GaAs) on silicon for use in R... »

EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing

EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing

EV Group (EVG) and Panasonic Smart Factory Solutions Co., Ltd. announced today that both companies have teamed up to provide a novel resist processing solution for plasma dicing that is developed for emerging applications, such as Internet of Things (IoT) sensors, MEMS, RFID, CMOS image sensors and thinned memories. This advanced solution, which incorporates the EVG®100 series of resist processin... »

EV Group Unveils Next-Gen Fusion Wafer Bonder for “More Moore” Scaling and Front-End Processing

EV Group Unveils Next-Gen Fusion Wafer Bonder for “More Moore” Scaling and Front-End Processing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the all-new BONDSCALE™ automated production fusion bonding system. BONDSCALE is designed to fulfill a wide range of fusion/molecular wafer bonding applications, including engineered substrate manufacturing and 3D integration approaches that use la... »

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications

Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass market. microLEDs are the key optical technology for nex... »

Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temp Covalent Wafer Bonding Technologies

Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temp Covalent Wafer Bonding Technologies

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that IHP – Innovations for High-Performance Microelectronics (IHP), a German research institute for silicon-based systems, highest-frequency integrated circuits, and technologies for wireless and broadband communication, has purchased an EVG® ... »

EV Group Accelerates 3D-IC Packaging Roadmap with Breakthrough Wafer Bonding Technology

EV Group Accelerates 3D-IC Packaging Roadmap with Breakthrough Wafer Bonding Technology

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the new SmartView® NT3 aligner, which is available on the company’s industry benchmark GEMINI® FB XT integrated fusion bonding system for high-volume manufacturing (HVM) applications. Developed specifically for fusion and hybrid wafer bonding, the... »

EV Group Earns Sixth Consecutive Triple Crown Win in VLSIresearch 2018 Customer Satisfaction Survey

EV Group Earns Sixth Consecutive Triple Crown Win in VLSIresearch 2018 Customer Satisfaction Survey

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that customers have once again voted the company one of the 10 BEST Focused Suppliers of Chip Making Equipment and one of the BEST Suppliers of Fab Equipment in the 2018 VLSIresearch Customer Satisfaction Survey, increasing its score in both award s... »

EV Group Secures Lithography Order from VTT Technical Research Centre for “More than Moore” Applications

EV Group Secures Lithography Order from VTT Technical Research Centre for “More than Moore” Applications

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received an order for its EVG®120 automated resist processing system from VTT Technical Research Centre of Finland (VTT). An existing customer of EVG’s wafer bonding and alignment systems, VTT is among the first to place an order for t... »

EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity

EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has started construction work for the next expansion phase of its corporate headquarters. The new, state-of-the-art building will house EVG’s “Manufacturing III” facility, which will more than double the floor space for the final assemb... »

EV Group and IBM Sign License Agreement on Laser Debonding Technology

EV Group and IBM Sign License Agreement on Laser Debonding Technology

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and IBM (NYSE: IBM) today announced that the companies agreed to sign a license agreement on laser debonding technology. EVG plans to integrate IBM’s patented Hybrid Laser Release process into EVG’s advanced, field-proven temporary bonding and debonding equipmen... »

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