EV Group’s LITHOSCALE® maskless exposure solution is ideally suited for fine-pitch probe cards, which involve complex designs and product mixes...
Infrared laser cleave technology enables ultra-thin-layer transfer from silicon substrates with nanometer precision, revolutionizing 3D integration for advanced packaging and...
Company expansion driven by market growth in 3D/heterogeneous integration fueling strong demand for EVG hybrid bonding and other leading process...
Expanded collaboration includes installation of EVG’s LITHOSCALE® maskless exposure system, EVG®7300 UV-NIL system and complementary resist processing systems FLORIAN /...
Papers to highlight breakthrough capabilities of EVG’s hybrid bonding and metrology solutions for heterogeneous integration, and NIL solutions for meta-optics...
EVG achieves its highest rankings ever with 5 Star ratings across all applicable award categories; continues winning streak with 21st...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and...
Papers to highlight breakthrough capabilities of EVG’s hybrid bonding, LITHOSCALE® maskless lithography and NanoCleave™ layer release technology for advanced packaging...
ST. FLORIAN, Austria, November 7, 2022—EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS,...
IR laser cleave technology enables nanometer-precision layer transfer through silicon, eliminating glass substrates for advanced packaging and enabling thin-layer 3D...
ST. FLORIAN, Austria, August 30, 2022—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS,...
Successful full-system die-to-wafer transfer at EVG’s Heterogeneous Integration Competence Center™ demonstrates an important step forward in process maturity EV Group...
EVG achieves 5 Star rating for first time in both “10 BEST” and “THE BEST” suppliers segments; continues winning streak...
Technical papers to highlight the breakthrough capabilities of EVG’s LITHOSCALE® maskless lithography solution and OmniSpray® resist coating technology for “More...
Breakthrough wafer-level optics technologies help solve a key challenge of connecting many fibers to silicon chips for datacom and telecom...
EVG is the first semiconductor equipment supplier ever to receive Preferred Supplier status EV Group (EVG), a leading supplier of...
ST. FLORIAN, Austria, January 18, 2022—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS,...
EVG®40 NT2 offers breakthrough metrology performance to accelerate implementation of wafer- and die-level hybrid bonding and maskless lithography FLORIAN, Austria,...
WIESELBURG, Austria, August 25, 2021—Together with research partners Silicon Austrian Labs, Evatec, EV Group and TDK Electronics, ZKW is working...
EVG S&R Mastering Shop™ further lowers barriers to adoption of nanoimprint lithography for wafer-level and panel-level production applications such as...