Paul Lindner, Author at 3D InCites

3D Integration Enables More than Moore Technologies

3D Integration Enables More than Moore Technologies

Looking back at the last 10 years, it is very difficult to choose one single event that was the most pivotal for commercializing 3D integration technology. There have been many prior events that have driven 3D integration and aligned the whole industry in migrating from monolithic 2D to heterogeneous and 3D integration. From my perspective, the most path-breaking event was the rise of the backside... »

3D IC Implementation: Outlook for 2014

3D IC Implementation: Outlook for 2014

Mobile/smart devices will continue to drive innovation and volumes in the semiconductor industry in 2014. The much discussed “Internet of Things” is a vision for the next growth cycle, and while we see this vision eventually coming true, the industry is very early in the cycle. It will take a number of years for IoT to take over the growth story from mobile consumer devices. In the meantime, 3... »