ST. FLORIAN, Austria, November 7, 2022—EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS,...
IR laser cleave technology enables nanometer-precision layer transfer through silicon, eliminating glass substrates for advanced packaging and enabling thin-layer 3D...
ST. FLORIAN, Austria, August 30, 2022—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS,...
Successful full-system die-to-wafer transfer at EVG’s Heterogeneous Integration Competence Center™ demonstrates an important step forward in process maturity EV Group...
EVG achieves 5 Star rating for first time in both “10 BEST” and “THE BEST” suppliers segments; continues winning streak...
Technical papers to highlight the breakthrough capabilities of EVG’s LITHOSCALE® maskless lithography solution and OmniSpray® resist coating technology for “More...
Breakthrough wafer-level optics technologies help solve a key challenge of connecting many fibers to silicon chips for datacom and telecom...
EVG is the first semiconductor equipment supplier ever to receive Preferred Supplier status EV Group (EVG), a leading supplier of...
ST. FLORIAN, Austria, January 18, 2022—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS,...
EVG®40 NT2 offers breakthrough metrology performance to accelerate implementation of wafer- and die-level hybrid bonding and maskless lithography FLORIAN, Austria,...
WIESELBURG, Austria, August 25, 2021—Together with research partners Silicon Austrian Labs, Evatec, EV Group and TDK Electronics, ZKW is working...
EVG S&R Mastering Shop™ further lowers barriers to adoption of nanoimprint lithography for wafer-level and panel-level production applications such as...
EVG®770 NT enables large-area master stamp fabrication of complex micro- and nano-structures for augmented reality waveguides, wafer-level optics and advanced...
Joint Development Program will offer highly configurable, ultra-precision end-to-end hybrid bonding solutions to suit various applications, with optimal line balancing...
EVG Academy doubles the amount of training space and technical trainers; provides training on every class of EVG equipment and...
EVG®320 D2W die preparation and activation system provides seamless integration with third-party die bonders; completes EVG’s equipment portfolio for end-to-end...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
LITHOSCALE® incorporates EVG’s MLE™ (Maskless Exposure) technology to bring the benefits of digital lithography to a wide range of applications...
Newly opened Cleanroom V building nearly doubles cleanroom capacity and strengthens capabilities of EVG’s NILPhotonics® and Heterogeneous Integration Competence Centers...
EVG achieves ranking among THE BEST Suppliers to Foundation Chip Makers for the first time in survey results; continues win...
