EV Group, Author at 3D InCites

About EV Group

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners, and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.

EV Group News - Page 2

EV Group Establishes Heterogeneous Integration Competence Center

Mar 02, 2020 · By EV Group · Press Releases

New HI Competence Center to help customers accelerate new product development fueled by heterogeneous integration and advanced packaging EV Group...

EV Group Earns Exceptional Seventh Consecutive Triple Crown Win in VLSIresearch 2019 Customer Satisfaction Survey

Jul 23, 2019 · By EV Group · Press Releases

EVG continues win streak with 17th consecutive year listed among “THE BEST” suppliers in survey results; frequently cited by customers...

EV Group’s MLE Technology Revolutionizes Lithography

Jul 05, 2019 · By EV Group · Press Releases

EV Group (EVG) today unveiled its maskless exposure technology (MLE™), a revolutionary next-generation lithography technology developed to address future back-end...

EV Group Invests 30 Million Euros for Capacity Expansion at Corporate Headquarters in Austria

Jun 25, 2019 · By EV Group · Press Releases

Construction of an additional, large cleanroom in St. Florian am Inn creates additional development, demo and pilot production capacity ...

EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019

May 21, 2019 · By EV Group · Press Releases

Technical papers and interactive poster to highlight the breakthrough capabilities of EVG’s ComBond® high-vacuum bonding system and low-temp laser debonding...

EV Group Partners with NSI to Enable First Wafer-level Heterogeneous Integration of GaAs on Silicon for RF Front-end Module Manufacturing

Mar 22, 2019 · By EV Group · Press Releases

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, today announced that it has partnered with Ningbo...

EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing

Mar 14, 2019 · By EV Group · Press Releases

EV Group (EVG) and Panasonic Smart Factory Solutions Co., Ltd. announced today that both companies have teamed up to provide...

EV Group Unveils Next-Gen Fusion Wafer Bonder for “More Moore” Scaling and Front-End Processing

Dec 04, 2018 · By EV Group · Press Releases

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications

Dec 04, 2018 · By EV Group · Press Releases

Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of...

Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temp Covalent Wafer Bonding Technologies

Dec 04, 2018 · By EV Group · Press Releases

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

EV Group Accelerates 3D-IC Packaging Roadmap with Breakthrough Wafer Bonding Technology

Jul 03, 2018 · By EV Group · Press Releases

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

EV Group Earns Sixth Consecutive Triple Crown Win in VLSIresearch 2018 Customer Satisfaction Survey

Jun 26, 2018 · By EV Group · Press Releases

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

EV Group Secures Lithography Order from VTT Technical Research Centre for “More than Moore” Applications

May 16, 2018 · By EV Group · Press Releases

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity

May 03, 2018 · By EV Group · Press Releases

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

EV Group and IBM Sign License Agreement on Laser Debonding Technology

Mar 15, 2018 · By EV Group · Press Releases

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and...

EV Group Completes Latest Phase of Production Capacity Expansion at Corporate HQ

Dec 20, 2017 · By EV Group · Press Releases

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets,...

EV Group Installs Low-temperature Plasma Activation System for Compound Semiconductor Research at the University of Tokyo

Dec 13, 2017 · By EV Group · Press Releases

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

Leti Demonstrates World’s First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System

Nov 14, 2017 · By EV Group · Press Releases

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and...

EV Group and SwissLitho to Develop Joint Nanoimprint Lithography Solution for 3D Optical Structures with Single-Nanometer Accuracy

Oct 09, 2017 · By EV Group · Press Releases

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and...

EV Group Receives Multiple Lithography and Metrology System Orders for Wafer-Level Optics Manufacturing

Sep 14, 2017 · By EV Group · Press Releases

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

EV Group

About EV Group

EV Group News - Page 2

EV Group Establishes Heterogeneous Integration Competence Center

EV Group Earns Exceptional Seventh Consecutive Triple Crown Win in VLSIresearch 2019 Customer Satisfaction Survey

EV Group’s MLE Technology Revolutionizes Lithography

EV Group Invests 30 Million Euros for Capacity Expansion at Corporate Headquarters in Austria

EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019

EV Group Partners with NSI to Enable First Wafer-level Heterogeneous Integration of GaAs on Silicon for RF Front-end Module Manufacturing

EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing

EV Group Unveils Next-Gen Fusion Wafer Bonder for “More Moore” Scaling and Front-End Processing

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications

Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temp Covalent Wafer Bonding Technologies

EV Group Accelerates 3D-IC Packaging Roadmap with Breakthrough Wafer Bonding Technology

EV Group Earns Sixth Consecutive Triple Crown Win in VLSIresearch 2018 Customer Satisfaction Survey

EV Group Secures Lithography Order from VTT Technical Research Centre for “More than Moore” Applications

EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity

EV Group and IBM Sign License Agreement on Laser Debonding Technology

EV Group Completes Latest Phase of Production Capacity Expansion at Corporate HQ

EV Group Installs Low-temperature Plasma Activation System for Compound Semiconductor Research at the University of Tokyo

Leti Demonstrates World’s First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System

EV Group and SwissLitho to Develop Joint Nanoimprint Lithography Solution for 3D Optical Structures with Single-Nanometer Accuracy

EV Group Receives Multiple Lithography and Metrology System Orders for Wafer-Level Optics Manufacturing

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