EV Group, Author at 3D InCites

About EV Group

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners, and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.

EV Group News - Page 4

EV Group Celebrates Strong Growth and New Manufacturing Process Solutions at SEMICON West 2013

Jul 10, 2013 · By EV Group · Manufacturing

Demand For Flexible, High-Volume Manufacturing Solutions in 3D-IC/Advanced Packaging, MEMS, Power Device and Compound Semiconductor Markets Drive Growth SEMICON WEST,...

EV Group Pushes the Limits on 3D-IC Manufacturing for Next-Generation CMOS Image Sensory

Jul 08, 2013 · By EV Group · Press Releases

Enhanced wafer alignment metrology capability coupled with market-leading GEMINI® FB system creates closed-loop fusion wafer bonding solution to enable high-density...

EV Group Enhances Wafer Debonding Solutions Portfolio with New LowTemp Room-Temperature Debonding Platform

Jul 01, 2013 · By EV Group · Manufacturing

Three high-volume-production room-temperature debonding process types are supported by a supply chain of seven qualified adhesive suppliers to enable greater...

EV Group and Dynaloy Jointly Develop Complete Single-Wafer Cleaning Solution for 3D-IC/TSV, Advanced Packaging, MEMS and Compound Semiconductor Applications

Jun 17, 2013 · By EV Group · Manufacturing

CoatsClean™ combines process, equipment and formulation technology to deliver innovative, low cost-of-ownership approach to single-wafer photoresist and residue removal ST....

EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System for Micro-and Nano-Electronics Production

May 07, 2013 · By EV Group · Press Releases

Flexible System Integrates Spin/Spray Coating and Wet Processing for MEMS, Advanced Packaging and Compound Semiconductor Applications SEMICON SINGAPORE, May 7,...

EV Group Related Articles

EV Group Revolutionizes 3D Integration from Advanced Packaging to Transistor Scaling with NanoCleave Layer Release Technology

IR laser cleave technology enables nanometer-precision layer transfer through silicon,...

EV Group Expands Collaboration with ITRI on Heterogeneous Integration Process Development

ST. FLORIAN, Austria, August 30, 2022—EV Group (EVG), a leading...

Maskless Lithography Addresses Shift Toward Heterogeneous Integration and 3D Packaging

Moving from 2D scaling to heterogeneous integration and 3D packaging...

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