image001ST. FLORIAN, Austria, July 30, 2015—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received a 2015 3D InCites Award for its GEMINI®FB XT automated fusion wafer bonder in the category of 3D manufacturing equipment. Hosted by 3D InCites, an online media resource founded in 2009 to stir up interest in 3D IC integration and 3D packaging technologies, the 3D InCites Awards program recognizes achievements to further the commercialization of 3D integration technologies. Awards are presented to companies whose innovative products have contributed significantly to the advancement of innovative processes that enable interposer integration, 3D ICs, monolithic 3D, 3D memory, and 3D heterogeneous integration. Proceeds from the event go to support science-technology-engineering-mathematics (STEM)-related education programs and scholarships.

This year, 3D InCites received 14 nominations across five categories, including: design tools, devices, manufacturing equipment, inspection and metrology tools/equipment, and materials. A panel of industry expert judges determined the winners based on a number of criteria. In addition, 3D InCites registered members selected one nominee from the entire field to be awarded the Reader’s Choice Award. The awards were presented at a breakfast ceremony, sponsored by Micron, which took place during the SEMICON West tradeshow in San Francisco earlier this month.

EVG’s receipt of the 2015 3D InCites award follows on the heels of the company’s announcement earlier this month that it won all three coveted awards from VLSIresearch’s annual customer satisfaction survey, including awards for one of the 10 BEST Focused Chip Making Equipment Suppliers and one of the 2015 THE BEST Suppliers of Fab Equipment, as well as a 2015 RANKED 1st award in the Other Fab Equipment. EVG also previously won a 3D InCites Award for 3D manufacturing equipment two years ago for the company’s EVG850TB/DB XT temporary bonding and debonding platform.

The GEMINI FB XT—EVG’s next-generation fusion wafer bonding platform—combines several performance breakthroughs to move the semiconductor industry closer to the goal of high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs). Featuring up to a three-fold improvement in wafer-to-wafer bond alignment accuracy as well as a 50 percent increase in throughput over the previous industry benchmark platform, the GEMINI FB XT clears several key hurdles to the industry’s adoption of 3D-IC/TSV technology in order to drive continuous improvements in device density and performance without the need for increasingly costly and complex lithography processing.

“We are pleased to be recognized again by the 3D-IC community with a 3D InCites Award—this time, for our most advanced fusion wafer bonding platform—the GEMINI FB XT,” stated Dr. Thomas Uhrmann, director of business development at EV Group. “EV Group has been at the forefront of developing innovative solutions to speed the commercialization of 3D-IC technology. Through hard work and extensive collaborations with our customers and partners, we are now witnessing the transition of this new semiconductor technology into full-scale production. EVG is excited to be a part of this transformation and to be contributing to our customers’ and partners’ ability to realize the continued benefits of Moore’s Law through the vertical dimension.”

About 3D InCites
As a community, 3D InCites brings to life the people, the personalities, the ideas, and the minds behind 3D integration in a uniquely personal way. 3D integration requires open collaboration across the supply chain. Therefore, 3D InCites strives to inform key decision makers about progress in technology development, design, standards, and infrastructure to realize commercial production of interposer and 3D integration technologies. Participation through comments and contributions is encouraged. For more information, visit www.3DinCites.com.

About EV Group (EVG)
EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.

Contacts:
Clemens Schütte
Director, Marketing and Communications
EV Group
Tel: +43 7712 5311 0
E-mail: Marketing@EVGroup.com

David Moreno
Vice President,
MCA, Inc.
Tel: +1.650.968.8900, ext. 125
E-mail: dmoreno@mcapr.com

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