Xpedition® Package Integrator provides a holistic co-design methodology that automates planning and optimization of connectivity from a chip through multiple packaging variables, while targeting multiple PCB platforms. Engineers can quickly and easily assemble complete cross-domain systems (IC, package & board) and drive ball map plans and pin optimization through a rule-based methodology. Te... »
Industry’s first 2.5D/3D security IP from BroadPak provides trusted security and resilience needed for critical 2.5D/3D system integration and prevents hijacking of critical data. This new technology is shifting the paradigm in semiconductor industry and enables chip makers and system companies to develop new generations of secure products. This breakthrough technology prevents reverse engineeri... »
Amkor’s SLIM (siliconless integrated module) is a dies-last package technology providing the thinnest possible form factor with the highest level of integration by use of back-end-of-line technology combined with assembly-based fan-out architectures. It has optimal registration, 3D access to top and bottom side of package and the finest line RDL capability found in packaging today! Testim... »
The Xilinx Ultrascale VU440 3D FPGA is constructed using “Xinterposer” 3D IC technology jointly developed by Xilinx and TSMC. It uses a low-k dielectric chip fabricated on 20nm silicon node with a total of 375,000 micron bumps stacked on 25mm x 45mm silicon interposer and assembled with CoWoS. The composite 3D FPGA consists of approximately 19 billion transistors. Testimonial: The Ultrasca... »
OmniVision’s OV23850 PureCel image sensor utilizes the companies advanced stacked die process capture exceptional images and video in 23.8-megapixel resolution while maintaining a compact form factor, which is critical for the next-generation of slim smartphones and tablets. Testimonial OmniVision’s family of PureCel backside-illuminated image sensors use the company’s stacked di... »
CIRCL-AP™ is a cluster tool with multiple modules, covering all-surface inspection, metrology and review at high throughput for efficient advanced wafer level packaging (AWLP) process control. The CIRCL-AP provides production-proven, high sensitivity monitoring capability for multiple AWLP applications including 2.5D/3D integration, wafer-level chip scale packaging and fan-out wafer-level packag... »
SABRE® 3D is a next-generation electroplating product designed to meet leading-edge production requirements for advanced packaging applications. This product leverages proprietary front-end manufacturing technology and offers market-specific solutions for copper pillar and through-silicon via (TSV) fabrication. SABRE 3D offers industry-leading throughput along with reduced cost of consumabl... »
Nordson ASYMTEK’s programmable Tilt + Rotate 5-Axis Fluid Dispenser dispenses using 5 axes instead of 3. The X and Y tilt enables dispensing from a vertical position, varying tilt angles to all sides of a component and up to the top of a 3D stacked die with high precision and positional accuracy. Testimonial Jet dispensing of capillary underfill fluid is a standard process for producing semicond... »
SPTS’s Sigma® fxP, is a well established PVD system used in advanced packaging applications such as UBM and RDL. It utilizes batch degas technology that can improve Rc whilst maintaining high throughputs, despite the outgassing challenges posed from the increasing use of organics, such as mold in Fan-Out WLP. Testimonial Fan-Out Wafer Level Packaging (FOWLP) technology is an increasingly popula... »
The GEMINI®FB XT fusion wafer bonding platform features up to a 3X improvement in wafer-to-wafer bond alignment accuracy as well as a 50% increase in throughput over the previous industry benchmark platform. These performance breakthroughs clear several key hurdles to the industry’s adoption of 3D-IC/TSV technology. Testimonial According to the ITRS, high-density TSV applications require wa... »
TC-3040 is designed for advanced flip chip devices requiring improved heat dissipation. The material features a combination of low modulus and high elongation – enabling it to accommodate warpage-induced stresses. Key to the improved thermal performance : low contact resistance that silicones are known for, along with proprietary filler technology. Testimonial While advanced 2.5D or 3D... »
SOLDERON™ BP TS 6000 Tin-Silver is a lead-free chemistry for solder bump applications. From a single formulation, it is capable of plating speeds of 2-9+ µm/min, tunable composition and the industry’s most robust process window. This flexibility makes it ideal for applications from C4 bumping to micro-Cu pillar capping. Testimonial In the latest 2.5D and 3D packaging schemes utilizing copper ... »
Indium Corporation’s wafer bumping flux WS-3543 is a low-viscosity semiconductor-grade flux, specifically optimized for uniform solder bump formation across wafers up to 300mm (12 inches) in diameter. WS-3543 washes off completely, even after repeated application, reflow, and cleaning cycles, as may be seen in bump rework and after probe testing. Testimonial Indium Corporation’s wafer bumping ... »
The newly released Dynastrip™ DL9150 is a non-TMAH containing multi-purpose photoresist and post-etch residue remover. With outstanding cleaning and metal compatibility, this product raises the bar for achieving environmental, health, and safety compliance while also performing as well as comparable products that contain TMAH. Testimonial: Dynaloy’s new solvent, Dynastrip DL9150, has demonstra... »
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