Latest Posts - Page 6
EV Group Expands Production Capacity at Corporate Headquarters in Austria
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide
Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices, and CMOS image...
Outlook 2017: Advanced Packaging Technology Takes Center Stage
The era of “More than Moore” was alive and well in 2016 as the semiconductor industry witnessed many new developments...
Leti Orders HERCULES® NIL System from EV Group for Joint Nanoimprint Lithography Program
Nanoimprint lithography (NIL) system will bolster process development and demo capabilities of INSPIRE program EV Group (EVG), a leading supplier of... EV Group Expands High-Vacuum Wafer Bonding Capabilities of EVG ComBond Platform for High-Volume MEMS Manufacturing
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today... EV Group Receives Multiple Orders for GEMINI® FB XT Fusion Wafer Bonder for 3D Chip Stacking Production Applications
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today... Advanced Packaging and 3D IC Market Driving Strong Growth for EV Group’s Automated 300mm Polymer Adhesive Wafer Bonding Systems
ST. FLORIAN, Austria, August 31, 2015—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS,...
Semiconductor Supplier Updates from SEMICON West 2015
No SEMICON West would be complete without a few laps around Moscone North and South, and some one-on-one chats with...
Riding Out on a Horse and in on a Goat: 3D IC Predictions for MEMS
The Lunar New Year is soon upon us, and we will be celebrating the Year of the Goat with firecrackers,...
Lithography Process Innovations Part 2: Improving Thermo-mechanical Reliability of TSV Interconnects
In Part 1 of this article series, we noted that despite the potential benefits associated with 3D and interposer-based 2.5D... Market Outlook for Permanent Wafer Bonding
Permanent wafer bonding can be categorized based on bonding with or without an intermediate layer. Intermediate layers can be subcategorized... Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding
Enables fine-pitch connections for 3D applications, including image sensors, memory and 3D SoCs RESEARCH TRIANGLE PARK, N.C., May 27, 2014...
Process Improvements Target 3D IC Cost of Ownership
Customers have asked and suppliers are listening. One sign of progress from last year to this year at SEMICON Singapore’s... Triple I Prevails at EV Group
Invent, Innovate, Implement continues to be the mantra at EV Group, supplier of wafer bonding and lithography equipment for the MEMS,...
Europe in 3D: The EV Group Story Continues…
Rarely do I have the opportunity to visit a company two times and find something new to write about, never mind...
Europe in 3D: The 2014 Winter Tour
This winter, I’ve been invited to moderate panels at two 3D industry events. The first will be at the European... Dow Corning Joins EV Group’s Open Platform for Temporary Bonding Materials for 3D-IC Manufacturing
Both Innovators Join Forces to Offer Simple, Cost-Effective Temporary Bonding/Debonding Solution for High-Performance 3D-IC Packaging ST. FLORIAN, Austria, Sept. 3,...
EV Group: Never a Dull Moment
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. Sitting down with...
