Ziptronix, Author at 3D InCites

Ziptronix and Fraunhofer IZM-ASSID Collaborate on Development of Low-Cost 3D Integration Solutions

Ziptronix and Fraunhofer IZM-ASSID Collaborate on Development of Low-Cost 3D Integration Solutions

SAN JOSE, Calif. — Ziptronix, Inc., a wholly owned subsidiary of Tessera Technologies, Inc. (NASDAQ:TSRA) (“Tessera” or the “Company”) and the leader in low temperature wafer bonding technology, today announced it has entered into a development agreement with Fraunhofer IZM-ASSID (“Fraunhofer”). The companies will work together to integrate Ziptronix Direct Bo... »

Ziptronix Licenses DBI® Hybrid Bonding Patents to Sony for Advanced Image Sensor Applications

Ziptronix Licenses DBI® Hybrid Bonding Patents to Sony for Advanced Image Sensor Applications

RESEARCH TRIANGLE PARK, N.C., March 18, 2015 – Ziptronix Inc., a developer and provider of patented, low-temperature direct bonding technology for 3D integration, today announced a patent licensing agreement with Sony Corporation for application in advanced image sensors. The agreement marks the continued adoption of Ziptronix’s hybrid bonding patents for high volume applications. R... »

Fermilab Implements Ziptronix’s DBI Hybrid Bonding  in High-End 3D Image Sensors

Fermilab Implements Ziptronix’s DBI Hybrid Bonding in High-End 3D Image Sensors

Ziptronix Inc. today announced that its Direct Bond Interconnect (DBI) hybrid bonding has been implemented by Fermi National Accelerator Laboratory (Fermilab) to improve the performance of high-end 3D sensor arrays, which are used for particle detection in large-scale particle physics and x-ray imaging experiments. This is an example of three-layer DBI hybrid bonding in a 3D imaging chip, using D... »

Ziptronix and EV Group Demonstrate Submicron Accuracies  for Wafer-to-Wafer Hybrid Bonding

Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding

Enables fine-pitch connections for 3D applications, including image sensors, memory and 3D SoCs RESEARCH TRIANGLE PARK, N.C., May 27, 2014 – Ziptronix Inc. and EV Group (“EVG”) today announced they have successfully achieved submicron post-bond alignment accuracy on customer-provided 300mm DRAM wafers. The results were achieved by implementing Ziptronix’s DBI® Hybrid Bonding techn... »

Ziptronix Teams with Tezzaron and Novati Technologies to Accelerate 3D IC Development

Ziptronix Teams with Tezzaron and Novati Technologies to Accelerate 3D IC Development

Ziptronix Inc., provider of patented, low-temperature direct bonding technology for 3D integration, announced an agreement with Tezzaron Semiconductor Corporation and Novati Technologies, a wholly owned subsidiary of Tezzaron, as a next step toward the acceleration of 3D integration. As a key part of the agreement, Ziptronix sold its 3D IC development lab to Tezzaron, to be operated by Novati. Due... »