Ziptronix News
Ziptronix Licenses DBI® Hybrid Bonding Patents to Sony for Advanced Image Sensor Applications
RESEARCH TRIANGLE PARK, N.C., March 18, 2015 – Ziptronix Inc., a developer and provider of patented, low-temperature direct bonding technology... Fermilab Implements Ziptronix’s DBI Hybrid Bonding in High-End 3D Image Sensors
Ziptronix Inc. today announced that its Direct Bond Interconnect (DBI) hybrid bonding has been implemented by Fermi National Accelerator Laboratory... Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding
Enables fine-pitch connections for 3D applications, including image sensors, memory and 3D SoCs RESEARCH TRIANGLE PARK, N.C., May 27, 2014... 