Latest Posts - Page 5
EV Group Earns Astounding Eighth Consecutive Triple Crown Win in VLSIresearch 2020 Customer Satisfaction Survey
EVG achieves ranking among THE BEST Suppliers to Foundation Chip Makers for the first time in survey results; continues win...
3D InCites’ Mural Project Raised $4000 For IMAPS Foundation
If you’ve attended the IMAPS Device Packaging Conference over the past three years, you probably noticed a hand-drawn mural coming...
Heterogeneous Integration Technology Gets its Own Competence Center
The team at EV Group has done it again. They looked around at where the microelectronics industry is headed, identified...
What Role does the US-China Trade War Play in the Semiconductor Downturn?
The US-China trade war is top of mind for those who work in the semiconductor industry. How much of the...
EV Group’s MLE Technology Revolutionizes Lithography
EV Group (EVG) today unveiled its maskless exposure technology (MLE™), a revolutionary next-generation lithography technology developed to address future back-end...EV Group Invests 30 Million Euros for Capacity Expansion at Corporate Headquarters in Austria
Construction of an additional, large cleanroom in St. Florian am Inn creates additional development, demo and pilot production capacity ...
3D Integration Enables More than Moore Technologies
Looking back at the last 10 years, it is very difficult to choose one single event that was the most...
EV Group Accelerates 3D-IC Packaging Roadmap with Breakthrough Wafer Bonding Technology
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
EV Group Earns Sixth Consecutive Triple Crown Win in VLSIresearch 2018 Customer Satisfaction Survey
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
EV Group and IBM Sign License Agreement on Laser Debonding Technology
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and...
EV Group Completes Latest Phase of Production Capacity Expansion at Corporate HQ
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets,... EV Group Installs Low-temperature Plasma Activation System for Compound Semiconductor Research at the University of Tokyo
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today... Leti Demonstrates World’s First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and... EV Group and SwissLitho to Develop Joint Nanoimprint Lithography Solution for 3D Optical Structures with Single-Nanometer Accuracy
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and... EV Group Receives Multiple Lithography and Metrology System Orders for Wafer-Level Optics Manufacturing
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today... EV Group Celebrates 20 Years of Supporting Micro- and Nano-Technology Development in Japan
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
The Brighter Side of SEMICON West 2017
Generally, I avoid reading other journalists’ coverage of events I’ve attended until I’ve had a chance to finish my own... 