SEMICON Singapore gets underway next week (May 19-21), and the 3D track speaker line-up features presentations by several 3D InCites partners. If you plan on attending, be sure to put these sure-to-be interesting talks on your personal agenda.

On Thursday, May 20, from 11:30 – 12:00, Gilbert Lecarpentier, Business Development, Manager Smart Equipment Technology will present a paper titled High Accuracy Die to Wafer (D2W) Placement and Bonding Enabling High Density and Fine Pitch in 3D- C with High Density TSV. Gilbert recently participated in an online discussion on this topic on 3D InCites.

Immediately following Gilbert’s talk (12-12:30) will be Ian Wright, Senior Director of Asia Business Development SPP Process Technology Systems Ltd (SPTS) with a paper titled Integrated, High Reliability 3D- IC TSV Processing.

On Friday, May 21, speaking back-to-back and each addressing temporary bonding and debonding processes are Erwin Hell, Technical Sales Support Manager for SUSS MicroTec; and Markus Wimplinger, Corporate Technology Development and IP Director, EV Group. Hell’s paper focuses on debonding of temporary bonded wafers with topography; while Wimplinger’s will offer a general update on challenges and achievements of temporary bonding and debonding processes.

Other presentation topics throughout the two-day event address developments taking fan-out WLP into the third dimension by representatives of ST Microelectronics, STATS ChipPAC and Freescale; 3D packaging opportunities by representatives of both ITRI and IME; and other process and material focused presentations by representatives of Novellus, Hitachi and Sumitomo Bakelite Pte Ltd. 

Find the full agendas here:


Francoise von Trapp

They call me the “Queen of 3D” because I have been following the course of…

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