TSVs

Talking Nerdy with Exhibitors at IWLPC 2018

Talking Nerdy with Exhibitors at IWLPC 2018

With heterogeneous integration, 3D, and advanced wafer-level packaging technologies officially declared the rising stars of the semiconductor industry, materials, process and equipment suppliers have pulled out their shiniest bells and whistles. Here’s a sampling of news and products that were on display at IWLCP 2018, October 23-25, 2018 at the Doubletree Hotel in San Jose. Indium Corporation... »

Technical Tidbits from IWLPC and MSEC 2017

Technical Tidbits from IWLPC and MSEC 2017

It’s been a busy few weeks for me as I attended both the International Wafer Level Packaging Conference (IWLPC), October 24-26, 2017 at the DoubleTree in San Jose and SEMI-MSIG’s MEMS and Sensors Executive Congress, October 31-Nov. 2, at the Hayes Mansion in San Jose. In addition to taking in some great keynotes and technical sessions, I had the opportunity to meet with several companies to fi... »

aveni® S.A. Raises EUR 8.9M ($10.5M) to Commercialize its Innovative Metallization Technologies

aveni® S.A. Raises EUR 8.9M ($10.5M) to Commercialize its Innovative Metallization Technologies

PARIS, FRANCE–(Marketwired – Oct 24, 2017) – aveni S.A., developer and manufacturer of market disrupting wet deposition technologies and chemistries for 2D interconnects and 3D TSV packaging, today announced it has completed an EUR 8.9M ($10.5M) capital raise from Merck Ventures, the corporate venture arm of Merck, along with existing investors. “This new investment by corp... »

EV Group Expands Production Capacity at Corporate Headquarters in Austria

EV Group Expands Production Capacity at Corporate Headquarters in Austria

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is expanding production capacity at its corporate headquarters in St. Florian am Inn, Austria. Representing a 20 million Euro investment, the expansion will include the construction of a new building that provides additional production and te... »

SMIC Signs License Agreement For Invensas’ DBI Technology

SMIC Signs License Agreement For Invensas’ DBI Technology

Semiconductor Manufacturing International Corporation, one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, has executed a technology transfer and license agreement for Invensas’ Direct Bond Interconnect (DBI®) technology. Through this agreement, SMIC will be able to offer this bonding technology for use by image sensor manufa... »

EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide

EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide

Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices, and CMOS image sensors FLORIAN, Austria, May 16, 2017—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved an industry milestone with more than 1100 EVG wafe... »

UnitySC Pushes The Boundaries of Measurement with New Nanotopography Metrology Platform

UnitySC Pushes The Boundaries of Measurement with New Nanotopography Metrology Platform

Grenoble, France, March 14, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today introduced its new NST Series at SEMICON China in Shanghai. The NST Series is the world’s first non-contact metrology solution for accurately measuring the nanoscale surface topography of semiconductor wafe... »

More-than-Moore 2.5D and 3D SiP Integration

More-than-Moore 2.5D and 3D SiP Integration

A new book on 2.5D and 3D integration, written by Riko Radojcic and published by Springer, will soon be available. The book addresses the current status of More-than-Moore system-in-package (SiP) technologies and explores the technical and business tradeoffs for deploying these options in high volume commercial IC products. We’re pleased to provide an excerpt of the preface: “There is a lot of... »

European 3D Summit: Putting 3D Packaging To Work

European 3D Summit: Putting 3D Packaging To Work

Now that we’ve determined that advanced wafer level packaging — including embedded technologies, fan-out wafer level packaging, and 3D packaging — add value to the devices in which they are implemented, the next step is understanding which option offers the best cost/performance ratio for specific product applications. One of the goals of this year’s European 3D Summit was to bring togethe... »

A Metallization Technology Whose Time Has Come

A Metallization Technology Whose Time Has Come

2015 was a year marked by through silicon via (TSV) productization for three memory applications and a push for more MEMS and sensor technologies, as connectivity goes beyond computer-to-computer to thing-to-thing. For aveni, 2015 brought a new name, and leaps forward in commercializing our wet, molecular buildup process that provides a cost-effective alternative to conventional and costly metalli... »

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