Riko Radojcic, Author at 3D InCites

More-than-Moore 2.5D and 3D SiP Integration

More-than-Moore 2.5D and 3D SiP Integration

A new book on 2.5D and 3D integration, written by Riko Radojcic and published by Springer, will soon be available. The book addresses the current status of More-than-Moore system-in-package (SiP) technologies and explores the technical and business tradeoffs for deploying these options in high volume commercial IC products. We’re pleased to provide an excerpt of the preface: “There is a lot of... »

Intercepting IC Products with a Disruptive Technology Option

Intercepting IC Products with a Disruptive Technology Option

Much has been written about the challenges that corporations face – especially established corporations – in adapting to a disruptive technology and the associated paradigm shifts. Most of the tomes on the subject focus on corporate management strategies. My intent is to discuss these challenges from a technology point of view – specifically when it comes to adopting so-called 2.5D and 3D d... »