Xperi Corporation (Nasdaq: XPER) and its brands DTS, IMAX Enhanced, HD Radio, and Invensas, are dedicated to creating innovative technology solutions that enable extraordinary experiences for people around the world. Xperi’s solutions are licensed by hundreds of leading global partners and have shipped in billions of products in areas including premium audio, automotive, broadcast, computational imaging, computer vision, mobile computing and communications, memory, data storage, and 3D semiconductor interconnect and packaging.
Invensas semiconductor technologies can be found in DRAM memories, image sensors, RF devices, MEMS sensors, processors and mixed signal devices currently in high volume production at leading original equipment makers (OEMs), original design manufacturers (ODMs), and integrated device manufacturers (IDMs).
Invensas DBI® Ultra is a die-to-wafer hybrid bonding 3D interconnect technology platform that makes it possible to manufacture 4, 8, 12 or 16-high 3D stacked memory while meeting the stringent packaging height and performance requirements for next generation high-performance computing. DBI Ultra enables high bandwidth and high performance 2.5D and 3D integration of memory, CPU, GPU, FPGA or SoC.
Invensas DBI® is a low temperature wafer-to-wafer hybrid direct bonding technology that allows wafers to be bonded with exceptionally fine pitch 3D electrical interconnect. Invensas ZiBond® is a low temperature homogenous (e.g. oxide-to-oxide) direct bonding technology that forms strong bonds between wafers with same or different coefficients of thermal expansion (CTE). DBI and ZiBond are already successfully incorporated into image sensors and RF components shipping in hundreds of millions of smartphones around the world.
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