IMAPS 20th Annual Device Packaging Conference – Event Highlights
The International Microelectronics Assembly and Packaging Society (IMAPS) 20th annual Device Packaging Conference (DPC), is scheduled from March 18 to 21 in Fountain Hills, AZ. Simultaneously, the Workshop on Advanced Packaging for Medical Microelectronics will take place at the WeKoPa Resort and Conference Center. This conference serves as a dynamic platform for scientists, engineers, professors, students, and industry professionals to engage in conversations regarding innovation within device packaging.
3D InCites Events at IMAPS DPC 2024
As the Official Industry Partner, 3D InCites has several key events happening during IMAPS DPC 2024. First, is the 2024 3D InCites Awards Ceremony, which takes place on Tuesday morning, after the keynote talks at 9:55. Learn about this year’s 3D InCites Awards Winners. On Wednesday evening, 3D InCites member companies and their guests are invited to a 3D InCites Member Social: The Back Yard Olympics.
Lastly, for the third consecutive year, KLA is the title sponsor of the Hike for DEI, which takes place on Thursday afternoon, leaving WeKoPa at 12:30. Details are here.
IMAPS DPC 2024 Agenda Featuring 3D InCites Members
IMAPS DPC 2024 promises an enriching experience with five keynote talks, a half-day of professional development courses, and three conference tracks chaired by several 3D InCites Members:
- Mike Kelly, Amkor Technology
- Keith Best, Onto Innovation
- Vik Chaudhry, Amkor Technology
- Jobert van Eisden, MKS/Atotech
The program will cover a range of topics across three tracks, including:
- Heterogeneous integration
- Fan-0ut, wafer level packaging (WLP), and flip chip
- Next-gen applications like automotive and 5G/6G.
On Monday, March 18, Mark Gerber (ASE) will be conducting a class on System-in-Package (SiP) System Solutions Through Miniaturization from 8 a.m. to 10 p.m. and The Evolution of Flip Chip Package Technology from 1 p.m. to 3 p.m.
On Tuesday, March 19 from 9:10-9:55, Arvind Kumar, IBM will deliver the opening keynote, Meeting the Explosive Demands of AI with Chiplet Architectures
Technical Tracks
Heterogeneous 2D & 3D Integration Track: Process Development
Divya Taneja, IBM
Reliable Direct Bonded Heterogeneous Integration ( DBHI) for AI Hardware
Tuesday, March 19, 2024, 10:45- 11:15am
Manjusha Mehendale, Onto Innovation
Application of Picosecond Acoustic Metrology for Monitoring Metal Films in Advanced Packaging
Tuesday, March 19, 2024, 11:15-11:45am
Lars Böttcher, Fraunhofer IZM
High-Density Organic Substrates for Chiplet Technologies
Tuesday, March 19, 2024, 11:45-12:15 am
Fan-Out, Wafer Level Packaging & Flip Chip Track: Design & Application
John Park, Cadence
A Novel Approach to Co-Design of Analog and RF Multi-Die Packages
Tuesday, March 19, 2024, 9:55-10:14 am
Gaurang Gunde, DECA
Delivering the Full Benefits of Maskless Lithography and Adaptive Patterning with Comprehensive Design Automation
Tuesday, March 19, 2024, 11:15-11:45 am
Fan-Out, Wafer Level Packaging & Flip Chip Track: Fan-Out Technology
John Chang, Onto Innovation
FOPLP Lithography Die Shift Error Challenges And Solution Using Feedforward Adaptive Shot Technology
Tuesday, March 19, 2024, 4:30-5:00 pm
Johannes Ruoff, Zeiss
Rapid 3D X-ray Wafer-level Inspection of Interconnects in Advanced Packaging
Tuesday, March 19, 2024, 5:00-5:30 pm
Jan Vardaman, TechSearch International, Arvind Kumar, IBM
Mike Kelly, Amkor
Evening Panel Discussion: Looking for the Next Killer Application: Will Heterogeneous Integration be the Enabler?
Tuesday, March 19, 2024, 7:00-8.00pm
Heterogeneous 2D & 3D Integration Track: Design and Technology
Clifford Sandstrom, DECA
Achieving Large-Scale HBM Integration with Adaptive Pad Stacks on Molded Embedded Bridge Die Interposers
Wednesday, March 20, 2024 2:00-2:30 pm
Shelby Nelson, Mosaic Microsystems
Thin Glass Interposers with High-Density Interconnects
Wednesday, March 20, 2024 2:30-3:00 pm
Lihong Cao, ASE
Advanced Mechanical Analysis Workflow for Chiplets Integration Predictive Design
Wednesday, March 20, 2024 3:00-3:30 pm
Eelco Bergman, Saras Micro Devices
Saras Embedded STile IPD Technology for High-Performance Power Delivery Networks
Wednesday, March 20, 2024, 4:30-5:00 pm
Heterogeneous 2D & 3D Integration Track: Product Application
Mike Kelly, Amkor Technology
Chiplets and Heterogeneous IC Packaging: Building Blocks and Tradeoffs
Thursday, March 21, 2024, 10-10:30 am
Lee Sheng, ASE
Heterogeneous Integration Structure with Fanout and Substrate for High-end Product
Thursday, March 21, 2024, 11:30 am-12:00 pm
Fan-Out, Wafer Level Packaging & Flip Chip Track: Flip Chip Technology
Britta Schafsteller, MKS-Atotech
Soldering Defects on Immersion Tin and the Impact of the Tin-oxide Layer
Thursday, March 21, 2024, 11:00 am-11:30 pm
Next-Gen Applications Track: Packaging for Evolving Markets and Needs
Sheng Lee, ASE
Embedded Multi-die Technology for SESUB Application
Thursday, March 21, 2024 10:00 am-10:30 pm
Poster Session
Nils Anspach, LPKF Technologies
Enhancing Microelectronic Performance: Investigation on Surface Morphology and Roughness of Laser-Induced Deep Etching (LIDE) Micro-structured Glass
YoungDo Kweon, Amkor Technology
High Thermal Performance Thermal Interface Material (TIM) for Advanced Semiconductor Products
Roland Rettenmeir, Evatec
Back Side Metalization for High-Performance Computing
Oliver Zhao, Adeia
Surface Metrology and Defect Characterization for Hybrid Bonding
KyungSu Kim, Amkor Technology
Low-cost Solution for Thermally Enhanced, Heat-Spreader ChipArray® BGA (CABGA) Packages
Mike Flatley, Amkor Technology, Inc.
Pursuing Optimal Cost of Ownership in Leadless Leadframe Packaging
Vineet Pancholi, Amkor Technology, Inc.
Amkor In-house Test Solutions
Meet 3D InCites Exhibitors in the Exhibit Hall
Attendees can also walk through the Exhibit Hall at the 2023 Device Packaging Conference and listen to exhibitors talk about their experiences. 3D incites member exhibits include:
