Latest Posts
LPKF Delivers Key Strategic Technology to Fraunhofer’s Glass Panel Technology Group
LPKF Laser & Electronics SE is one of the initiators of the Glass Panel Technology Group (GPTG), a consortium encompassing...
October Member News: Shaping a Smarter, More Connected Semiconductor Future
October proved to be a dynamic month across the semiconductor and advanced packaging ecosystem, marked by innovation, expansion, and global...
August Member News: Pivotal Shifts in Leadership, Investments and Innovation
The month of August held pivotal shifts in the semiconductor industry, marked by leadership transitions, targeted investments, and continued innovation...
July Member News: Bold Investments and Strategic Acquisitions
July marked a dynamic period for our community members, characterized by bold investments, strategic acquisitions, and advancements in AI-driven design...
Artificial Intelligence is Driving Panel Level Packaging
An Intel engineer holds a test glass core substrate panel at Intel’s Assembly and Test Technology Development factories in Chandler,...
February Member News: Expansion, Collaborations, and Events Galore
February member news shows dynamic activity for semiconductor industry, with exciting advancements in technology, strategic expansions, key industry events, and...
Interconnectology Saves the World!
In 2007, when I was managing editor at the now defunct Advanced Packaging Magazine, we went out on a limb...
SEMICON West 2024 “Stronger Together” Member Preview
SEMICON West 2024 is themed Stronger Together. SEMI’s message of the year is focused on the need for global collaboration...
EV Group and Fraunhofer IZM-ASSID Expand Partnership in Wafer Bonding for Quantum Computing Applications
EV Group and Fraunhofer IZM-ASSID partnership kicks off with the installation of EVG850 automated laser debonding system at the newly...
May Member News: Strategic Moves, Product Launches, Sustainability and more
May member news showcases significant strides in advancing semiconductor technologies and fostering sustainability efforts. From strategic divestitures and innovative product...
SEMI Europe 3D & Systems Summit 2024 Community Member Preview
The 2024 SEMI Europe 3D & Systems Summit takes place on June 12-14 at the Hilton Hotel in Dresden, Germany....
ECTC 2024 3D InCites Community Member Preview
2024 is a big year for 3D InCites members at the Electronic Components and Technology Conference (ECTC). With 34 of...
April Member News: Earth Day, Partnerships, Notable Achievements
As the semiconductor industry continues to experience a surge of innovation, companies worldwide are collaborating to propel technology forward while...
IMAPS DPC 2024 Community Member Preview
IMAPS 20th Annual Device Packaging Conference – Event Highlights The International Microelectronics Assembly and Packaging Society (IMAPS) 20th annual Device...
Fraunhofer IZM Manages to Automate Measuring Optical In-glass Waveguides
December 12, 2023 The use of glass as substrate in electronics manufacturing enables the additional transmission of optical signals through...
Member Monthly Highlights – November
IMAPS held its Arizona Chapter Event at Deca Technologies, which included a presentation from Clifford Sandstrom on: “Achieving High-Density Die-to-Die Integration with...
SEMICON Europa 2023 Community Member Preview
SEMICON Europa 2023, co-located with productronica in Munich, Germany makes for one of the strongest single events for electronics manufacturing...
Community Member Monthly News – October
October flew by and our community members were busy… Deca was the recipient of the prestigious IMAPS Corporate Recognition Award...
