Latest Posts - Page 2
Packaging, Connecting, and Integrating: 30 years of Fraunhofer IZM – 30 years of packaging and interconnection excellence in microelectronics
September 20, 2023 The Fraunhofer Institute for Reliability and Microintegration IZM is marking its thirtieth year with a high-profile international...
IMAPS San Diego Community Member Preview
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This...
Announcing the Winners of the 2018 3D InCites Awards
We are pleased to announce the winners of the 2018 3D InCites Awards, sponsored by KLA-Tencor and EV Group and...
European 3D Summit 2018: Fraunhofer Tour and Presentations
This year’s European 3D Summit in Dresden, which highlighted “Heterogeneous Integration Driving 3D”, was led off by presentations and a...
Fifty Shades of Fan-out Discussed at ECTC 2017
The fan-out conversation that started at IMAPS DPC 2017 in March continued this week at the annual Electronics Components Technology...
Meet Us at ECTC 2017 in Walt Disney World
As each year passes, advanced packaging technologies offer more versatile solutions for cost-effective low-end applications, while 3D integration advancements continue...
Fraunhofer IZM Panel Level Packaging Consortium Launches in Berlin
In the bric-à-brac collection that seems to form my particular set of memories and mental associations, I have at least...
Ziptronix and Fraunhofer IZM-ASSID Collaborate on Development of Low-Cost 3D Integration Solutions
SAN JOSE, Calif. — Ziptronix, Inc., a wholly owned subsidiary of Tessera Technologies, Inc. (NASDAQ:TSRA) (“Tessera” or the “Company”) and...
Does 3D Integration Need to Go to HVM To be Real?
Consider for a moment that the ultimate goal of 3D integration is not to achieve high volume manufacturing (HVM) in...
Silicon Saxony: Leading the Charge in More than Moore
Since the days even before the reunification of Germany; Saxony, and particularly Dresden, has been a vital center for microelectronics development...
3D TSV without Limits
What can we expect out of 2.5 and 3D TSV Integration? What are the three leading-edge R&D institutes in 2.5...
European 3D TSV Summit: 3D TSVs Come of Age
Here I am, on my way back from Minatec Campus in Grenoble, France, where I attended SEMI Europe’s premiere European...