Let’s catch up on what we missed among our community…
Cadence completed the acquisition of the SerDes and memory interface PHY IP business from Rambus.
At ISES EU Power in Italy, Dr. Stefan Pieper, Global Application Manager for Semiconductor, spoke about electroless metallization for power semiconductors and introduced MKS’ Atotech’s latest solution. Stefan demonstrated the advantages of MKS Atotech’s maskless metallization on an example of an ENEPIG final finish that can be used as the basis for connecting the power semiconductor via wire bonding, soldering or sintering to the outside.
Brewer Science’s Dongshun presented Novel Materials for Advanced Packaging, at the Advanced Packaging Summit in South Korea answering some of the most pressing questions facing temporary and permanent bonding application. Rama provided insight to the Recent Advances in Materials for Advanced Packaging in her presentation as a part of the Heterogeneous Integration Global Summit.
Brewer Science introduced its new BrewerBOND® 703 laser release material, with ultralow UV transmittance providing a safeguard against UV laser energy interference on delicate device wafers.
Amkor Technology, Inc. participated in the International Semiconductor Executive Summits EU Power 2023 September 14-15 in Lake Maggiore, Italy. David Clark, VP of Product Marketing was the moderator of the panel “Packaging & Integration Requirements and Different Approaches to SiC & GaN Packaging.”
Evatec’s Edmund Schuengel, Manager Solution Design, spoke about how digitalization changes its coating systems and the way we use them at the International Congress Center Dresden during V2023.
The MKS’ Atotech team was in India attending the IPCA Show 2023 in Bangalore at BIEC, the annual PCB event parallel to electronica and productronica India.
At IMAPS-UK EMPC 2023, Finetech CTO Sascha Lohse contributed with a presentation on the company’s new fine pitch micro Indium bump interconnect high-yield flip chip bonding process. Combined with the 0.3 micron die bonder FINEPLACER® femto 2, it’s great for the demanding bonding processes associated with IR Focal Plane Arrays (FPA), quantum processors or Micro LED displays.
SEMI published its 200mm Fab Outlook to 2026 repor with great news about 200mm fabs. Semiconductor manufacturers worldwide are projected to increase 200mm fab capacity by 14% from 2023 through 2026, adding 12 new 200mm volume fabs as the industry reaches a record high of more than 7.7 million wafers per month.
Being one of the leading PCB systems solutions provider, MKS’ Atotech recently launched a new software suite to help customers in their journey to transform to digital manufacturing. MKS’ Atotech’s Digital Factory Suite (DFS) platform connects to the on-site production equipment and continuously collects process and equipment data during manufacturing. Using advanced analytics, and platform applications such as Condition Monitoring, and Traceability, the collected data generates high-value insights into equipment and process conditions and create optimal landscape for data modeling and predictions.
MKS’ Atotech introduced a production-proven zinc flake coating system Zintek® 300 HP in combination with Techdip® Black SL HC to the Indian motorcycle market. Bajaj Auto, known for manufacturing TRIUMPH & KTM bikes and being a valued motorcycle manufacturer globally, has approved its coating system for motorcycle fasteners.
The ACM Research team was in Brugge, Belgium, for this year’s UCPSS conference showcasing its customized cleaning and plating solutions designed from the ground up for flexibility, efficiency, and improved wafer yield.
Kiterocket was chosen as agency of record by DSV IMS, a global leader in supply chain and vendor-managed inventory services for advanced manufacturing operations.
Plasma-Therm announced the acquisition of thinfilmequipment, a European leader in advanced thin-film processing and deposition equipment. This acquisition will strengthen Plasma-Therm’s position in the global market and allow them to bring their innovative technologies to more customers around the world.
Fraunhofer IZM celebrated 30 years of packaging and interconnection excellence in microelectronics by hosting a symposium “Crossing Frontiers in Microelectronics.” The Institute that now employs more than 400 people at its three sites was founded by 21 German scientists on a mission which birthed the Fraunhofer Research Institution for Reliability and Microintegration.
QP Technologies was honored with an “Excellence in Manufacturing Achievement Award” from Mixed-Signal Devices Inc., one of the industry’s leading manufacturers of high-performance clock and timing products.
Taro Fujie, CEO of Ajinomoto Co. Inc. visited three North American affiliates of the Ajinomoto Group including, Ajinomoto Cambrooke, Inc., Ajinomoto Foods North America, Inc. and Ajinomoto Althea, Inc. (Ajinomoto Bio-Pharma Services US.) During Mr. Fujie’s time in the U.S., he met and had dialogue with employees, learned more about specific U.S. based businesses and spoke to investors about our Group’s value and future prospects.
Finetech officially opened its 7th Finetech location in Bangkok, Thailand, marking a significant milestone in its global growth strategy. After establishing a strong presence in Germany, the USA, China, and Japan, Finetech expanded into Southeast Asia to stay closer to customers and emerging markets.
ASE’s Christophe Zinck deliverdc an informative and technically sound presentation at the SEMI Europe MEMS & Imaging Sensors Summit, supported by Reinhold Merkl, Bradford Factor, Patricia MacLeod, LIONEL C., Roberto Dossi, and Jean-Francois SAUTY. But more importantly, Christophe spoke for the entire team ASE when he paid tribute to ASE’s VP of Europe who died unexpectedly, Fuyu Shih, an inspirational leader, and precious friend, devoted mentor, and innovative collaborator, for so many across the world.
KLA employees in Portland, Oregon partnered with Habitat for Humanity Portland Region and the Dougy Center to build playhouses for children grieving from recent family loss. This heartfelt initiative was made possible with the support of the KLA Foundation.
Giel Rutten, the President and CEO of Amkor Technology, Inc., talked with Nasdaq to discuss how Amkor has secured a prominent position in advanced technology since its inception 55 years ago. He also elaborated on the significance of being part of the Nasdaq listed community alongside other pioneering tech companies.
