Power semiconductor packages are used in high temperature, high voltage environments. With the increase of electric vehicles (EVs) and hybrid...
It’s been quite a time for the entire electronics supply chain. Here’s what we know. This current strain on chips...
The 17th Annual Device Packaging Conference (DPC 2021) will be held as an online global event, from April 12-15, 2021. It is an international...
Like every other awards event in the past year, the 2021 3D InCites Awards Program had to make some adjustments...
Introduction Product burn-in (BI) is an indispensable step in the production test flow to ensure good quality and a properly...
For the last several years, we held the 3D InCites Mural Project, in conjunction with the 3D InCites Awards, in...
March 3, 2021 – Wide bandgap (WBG) semiconductor technologies have created new challenges and opportunities for power packages. Developments such...
TEMPE, Ariz., February 23, 2021 ― Amkor Technology, Inc. (Nasdaq: AMKR), a leader in advanced packaging technologies that support high-growth...
Implementation of the 5G radio frequency (RF) standard is increasing rapidly [1]. Over the past four to six quarters, there...
More on TSMC’s SoIC Hybrid Bonding Technology Nikkei Asia announced that TSMC is working with Google and AMD to develop...
2020 has been a year for the books. Honestly, between the divisiveness in the USA caused by this year’s election...
Because IMAPS is a society, there is a strong community aspect to its events. It was good to see that...
Like many other industry conferences, the Electronic Design Process Symposium (EDPS 2020) had to go virtual. Not only did it...
If you love, like me, to work on the bleeding edge of technology, you will find that your personal success...
With each passing year, emerging growth application areas such as Automotive, Cloud Computing, Industrial Automation, and Telecom (5G) Infrastructure are...
The business model in today’s competitive world of commerce has shifted over recent years to “services.” Companies like Microsoft, Amazon,...
Several decades ago, Asia began its quest to be a reliable and cost-effective IC packaging, assembly, and test partner for...
Heterogeneous integrated circuit (IC) packaging has made a full entrance into the high-performance computing arena. The target applications are broad,...
