The cynic inside often thinks “All hat, no cattle” about the newest new, new thing (right, Michael Lewis?). But if you were to consult the Gartner Hype Cycle listings from 2008 as I just did you would find, perhaps to your surprise, that Cloud Computing, 3-D Printing, Solid-State Drives, and Augmented Reality are now things, having made it past 2008’s inflated expectations, and the disillusi... »
Winter 2018, and Korea is at the center of the world in both sports and in electronics. Sports, of course, because of PyeongChang, host city for the 23rd Olympic Winter Games, with participants ranging from Eritrea to Tonga, along with the usual cold-weather-country (Norway, Canada, Sweden, etc.) players who showed up for the Games. And electronics, of course, specifically semiconductor device fab... »
For several years now, Herb Reiter, eda2asic, and John Ferguson, Mentor Graphics, have been evangelizing about the necessity of assembly design kits (ADK), similar to the process design kits (PDKs) for chip designers, to help drive ecosystem capabilities for what is collectively now being called high density advanced packaging (HDAP), comprising 2.5D IC, 3D IC and high density fan-out wafer... »
As part of the organizing committee, we believe this year’s IMAPS Device Packaging Conference really fulfilled what the announcement promised – the largest conference dedicated to the full spectrum of 3DIC and packaging, fan-out technologies and MEMS/sensors. We enjoyed 12% attendee growth over 2016, welcoming nearly 600 attendees from 20 countries, in addition to a 12th consecutive so... »
For the fourth consecutive year, the Impress Lounge played host to the 3D InCites Awards Ceremony, during which individuals, companies, and products were recognized by their peers for excellence in 3D packaging technologies. This year, we mixed it up a bit, and rather than recognize the processes, materials, designs and tools developed to enable advanced wafer level packaging (WLP), we focused o... »
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