May 2025 marked another active month for the semiconductor industry, showcasing innovation, global engagement, and strategic progress across multiple fronts. Member companies unveiled new technologies, strengthened industry connections through major conferences, and advanced key initiatives in packaging, AI, and sustainability. From executive appointments and facility openings to award recognitions and collaborative agreements, May Member News highlights reflect the sector’s ongoing commitment to growth, efficiency, and long-term impact.
Technology and Innovation
Circuits Integrated launched its new Kythrion SATCOM chipset, described as a game-changing solution for satellite communications. The chipset is intended to improve performance, integration, and power efficiency for satellite systems, marking a significant step forward in SATCOM technology. This launch highlights the company’s focus on addressing growing demands in the aerospace and defense sectors.
Indium Corporation reported a milestone in gallium extraction, completing its first successful recovery at its central New York facility in collaboration with Rio Tinto. The initiative aims to establish a North American gallium supply chain to address sourcing challenges for this critical material. Gallium is used in semiconductors, telecommunications, and clean energy, and supports Indium’s product portfolio, including thermal interface materials and liquid metal alloys.
Brewer Science is set to unveil a new smart warehouse monitoring system at the upcoming IWLA Industry Event. The system is designed to enhance operational efficiency and inventory accuracy in semiconductor manufacturing environments.
EV Group announced the launch of its LITHOSCALE® XT maskless exposure (MLE™) system, designed for high-volume manufacturing (HVM) applications in heterogeneous integration. This system offers up to a five-fold increase in throughput compared to its predecessor, featuring a dual-stage design and up to six exposure units. It is particularly suited for applications such as multi-die patterning, fan-out wafer-level packaging (FoWLP), and panel-level packaging, addressing the growing complexities in semiconductor packaging.
Collaborations and Acquisitions
Excillum and Baker Hughes Waygate Technologies announced a technology collaboration to advance high-resolution X-ray computed tomography (CT). The partnership is intended to enhance nondestructive inspection capabilities critical to semiconductor and industrial applications.
Deca and IBM Research announced a collaboration to produce Deca’s M-Series™ and Adaptive Patterning® technologies at IBM’s advanced packaging facility in Bromont, Quebec. The agreement supports IBM’s ongoing efforts to expand its capabilities in advanced packaging.
Expansion and Development
EV Group established a new subsidiary in Singapore to provide enhanced support to its customer base in Southeast Asia. The new office is intended to strengthen local service infrastructure and streamline access to EVG’s equipment and process solutions, particularly in areas such as wafer bonding and lithography.
Trymax recently reported reaching 500 process chamber installations in Asia. The milestone reflects continued adoption of the company’s plasma-based solutions across regional semiconductor manufacturing sites, supporting applications such as ashing, descum, and surface preparation
Veeco announced the receipt of over $35 million in orders for its advanced packaging lithography systems from IDM and OSAT customers. The orders reportedly reflect growing demand driven by AI and high-performance computing applications. The company’s AP300 platform has been described as a solution intended to meet a range of process needs in advanced packaging, with an emphasis on performance and cost efficiency.
KLA officially unveiled a new 237,000-square-foot R&D and manufacturing facility in Newport, Wales. The site includes expanded areas for customer collaboration, tool demonstrations, and production activities. The new facility is part of KLA’s expansion plans to support isemiconductor innovation and the growing technology ecosystem in South Wales.
ERS expanded its presence in Taiwan with the opening of a new Customer Demonstration Center in Zhubei. The facility is designed to showcase the company’s PhotoThermal debonding technology, including the LUM600S1 system, which targets high-yield, scalable solutions for AI chip production. This regional expansion aligns with reported forecasts suggesting significant growth in panel-level packaging (PLP) by 2030, particularly for applications requiring larger and more complex semiconductor devices.
Finetech announced plans to open a new office in Bangkok, Thailand this July, marking an expansion of its presence in Southeast Asia. The 217-square-meter facility includes workspaces, a demo room, and areas for training and application development. Positioned as a strategic hub for the APAC region, the office is intended to support Finetech’s sales and service operations, while strengthening local engagement in a growing semiconductor and electronics manufacturing market.
SurplusGLOBAL revealed newly updated signage for its SemiMarket platform at the company’s headquarters. The redesign is reportedly part of ongoing efforts to enhance brand visibility and reflect growth in its online and offline semiconductor equipment marketplace. SemiMarket aims to connect global buyers and sellers of legacy semiconductor equipment, with an offline parts mall located at the SurplusGLOBAL cluster for in-person sourcing.
Brewer Science released its Impact Report 2025, detailing the company’s recent advancements and sustainability initiatives within semiconductor materials and packaging. The report highlights Brewer Science’s ongoing commitment to innovation, environmental responsibility, and industry collaboration.
Awards and Recognition
ASE Japan established a permanent exhibit at the Yamagata Museum of Science and Industry in Takahata, highlighting its advanced semiconductor packaging technologies. The booth, located on the museum’s third floor in the Yamagata Industrial Zone, features interactive elements including projection mapping and wafer decryption. The initiative, reportedly intended to promote industry awareness, marks over 20 years of ASE’s presence in the region and reflects the company’s continued engagement with the local community.
ACM Research celebrated 20 years of innovation in Shanghai this month. The company is proud to be at forefront of groundbreaking semiconductor processing technology for the past two decades, and can’t wait for what the next chapter brings.
Kiterocket and its client Renesas Electronics received national recognition with a Bronze Anvil Award from the Public Relations Society of America (PRSA) for their B2B media relations program.
EV Group received a Five Star rating across all categories in this year’s TechInsights Global Semiconductor Supplier Awards, including first-place finishes in “Global Semiconductor Supplier,” lithography equipment, and specialty fab equipment segments. The company expressed appreciation for customer support and the trust placed in its products.
Industry Events
ERS’s Regine Beckmann attended the imec Technology Forum World in Antwerp, where industry leaders discussed the impact of AI on digital transformation. ERS Electronic showcased its wafer test and advanced packaging technologies, which are intended to help optimize yield and efficiency in semiconductor manufacturing.
ACM Research participated in this year’s Surface Preparation and Cleaning Conference (SPCC), engaging with industry peers to examine recent developments in cleaning and surface preparation technologies for electronics manufacturing. Discussions at the event addressed a range of topics, including front-end and back-end process improvements, as well as process monitoring challenges.
On May 13the IMAPS and ACerS San Diego chapters hosted a Lunch & Learn event at AI Technology in San Diego. Casey Krawiec of StratEdge Corporation presented a session on “Package and Die Attach Comparisons for High Power GaN Devices,” focusing on thermal simulations that compared heat dissipation across different die attach and package base materials. The event provided attendees with insights into thermal management strategies for high-power semiconductor devices.
Semilab served as a Gold Sponsor at the 48th International Spring Seminar on Electronics Technology (IEEE ISSE 2025), held from May 14–18 in Budapest, Hungary. Dr. Orsolya Kéri, Semilab’s R&D Technology and Market Analyst Team Leader, delivered a presentation titled “Metrology and Inspection Method Advancements Driven by the Advanced Packaging Market”. Her talk addressed the evolving demands of the advanced packaging sector and the corresponding innovations in metrology and inspection technologies.
SurplusGLOBAL participated in SEMICON SEA 2025, engaging with attendees at their booth and strengthening industry connections. The company acknowledged its teams from Singapore and Korea for their efforts in representing the brand. The event served as a platform for networking and showcasing legacy equipment solutions.
Fraunhofer IZM’s director, Prof. Dr.-Ing. Ulrike Ganesh, is scheduled to deliver a keynote on chiplet integration at the European Microelectronics and Packaging Conference taking place September 16–18, 2025, in Grenoble. The presentation will focus on the critical role of advanced packaging in enabling chiplet adoption, highlighting the advantages of chiplets over monolithic designs and emphasizing the need to address design, materials, testing, and reliability early in development.
Circuits Integrated’s Chief Commercial Officer Carl McMahon spoke at Orbit South Central on May 28 at the Surrey Space Centre. He joined Victor Man-Wai Kwan of Vicinity Technologies Limited and Allen Jiang of Amelia Space Technologies for a discussion on current trends in the space sector. The monthly event served as a platform for networking and knowledge exchange among professionals in the UK space industry.
SEMI’s SEMICON Southeast Asia 2025 will feature presentations from leading figures in the global semiconductor industry during its CEO Summit. The event is intended to foster dialogue on market trends, innovation, and collaboration opportunities across Southeast Asia’s rapidly growing semiconductor ecosystem.
Indium Corporation was represented at the SMTAS Electronics in Harsh Environments Conference, where Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East presented on dual-alloy solder paste systems. The presentation addressed challenges and solutions for maintaining reliable electronics performance in demanding conditions.
Indium also featured its power electronics solutions at SEMICON Southeast Asia 2025. The company’s exhibit included advanced soldering materials designed for reliability in high-temperature and high-power applications, addressing evolving requirements in automotive, industrial, and energy sectors.
Lastly, Indium showcased its advanced materials solutions for semiconductor packaging and assembly at ECTC 2025 in Dallas. The company highlighted products designed to address the challenges of heterogeneous integration and fine-pitch system-in-package (SiP) applications.
Brewer Science showcased its latest advanced material innovations at CS MANTECH and the IEEE Electronic Components and Technology Conference (ECTC) 2025. They company highlighted developments in semiconductor packaging materials reportedly engineered to improve thermal management, mechanical strength, and overall device reliability.
Koh Young also participated at ECTC 2025 IEEE Electronic Components and Technology Conference (ECTC), showcasing its latest inspection and measurement technologies. The company demonstrated innovations aimed at enhancing quality and yield in semiconductor manufacturing.
StratEdge showcased its LPA Series semiconductor packages at CS MANTECH and Space Tech Expo USA, highlighting their capabilities for advanced packaging in aerospace and defense applications. The company demonstrated how these packages address industry demands for reliability and performance in challenging environments.
Workforce Development
Amkor Technology recently launched an employee softball team as part of its efforts to foster cross-departmental engagement and team building. Participants from various departments have taken part in the Tempe business tournament, where the team currently holds a 5–7 record. The initiative has provided an exciting platform for collaboration and community involvement outside the workplace.
Career Advancements and Opportunities
Yield Engineering Systems has welcomed Sai Prashanth Dhanraj as the company’s new Vice President of Product Marketing & Business Development.
EV Group appointed Dr. Thomas Uhrmann as Vice President of Sales, effective May 1, 2025. Uhrmann, who brings experience in semiconductor processing, advanced packaging, and market development, is expected to lead the company’s global sales organization.
The company also announced the appointment of Dr. Bernd Dielacher as its new Business Development Director. With over a decade at the company, Dielacher has focused on identifying global market trends and advancing growth strategies in sectors such as MEMS, biomedical, and power devices. He holds a master’s degree in Microelectronics from the Vienna University of Technology and a PhD in Biomedical Engineering from ETH Zurich.
Onto Innovation is currently hiring for a Supervisor in Configuration & Release Engineering in Bloomington Minnesota. The role involves managing the configuration management process to ensure systems remain consistent and properly documented. It includes working across departments to develop, apply, and maintain configuration management standards and procedures. Click here to apply.
Amkor Technology is currently hiring for a Customer Service Manager in San Diego, CA. This position oversees all aspects of customer service engagement, including responding to RFQs, managing quotes, and tracking pricing and orders. Responsibilities also include coordinating with internal teams to support forecasting, material orders, payment tracking, and capacity planning. Click here to apply.
