The 11,000-square-foot multi-use property features offices, warehouse space and a cleanroom/demonstration lab HILLSBORO, Ore. – November 9, 2023: ACM Research,...
Third Generation Flux Cleaning Tool Meets Emerging Cleaning Requirements for Advanced 3D Packages FREMONT, Calif., September 12, 2023 (GLOBE NEWSWIRE)...
FREMONT, Calif., Dec. 12, 2022 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for...
New Ultra Track Leverages ACM’s Extensive Coater and Developer Expertise; ArF Model Expected to Ship in the Fourth Quarter of...
First system qualified at power semiconductor manufacturer in China FREMONT, Calif., Nov. 11, 2022 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ:...
Ultra Fn A Furnace Tool Shipped to China-Based Foundry Customer FREMONT, Calif., Sept. 27, 2022 (GLOBE NEWSWIRE) — ACM Research,...
Company leverages its extensive experience in single wet wafer cleans to enter post-CMP cleaning market FREMONT, Calif., July 12, 2022...
10 ECP ap tools purchased by top-tier Chinese OSAT to support wafer-level packaging applications FREMONT, Calif., May 06, 2022: ACM...
ACM’s Ultra C VI Tool Supports Most Semiconductor Clean Processes for Advanced Logic, DRAM and 3D NAND Manufacturing; Provides 50%...
21 ECP tools ordered by top-tier Chinese foundry and multiple advanced package houses FREMONT, Calif., Feb. 17, 2022 (GLOBE NEWSWIRE)...
Largest purchase order for wet bench systems in ACM’s history; Wet bench product line expanded to include Ultra-Low-Pressure Dry (ULD)...
FREMONT, Calif., Oct. 18, 2021 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing...
FREMONT, Calif., Oct. 18, 2021 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing...
ACM Research, Inc. a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced it...
Automated system for flat or notched wafers; multiple orders to ship during third quarter of 2021 Fremont, Calif. – August 25,...
Wet process offers edge etch and clean to improve wafer yield with high throughput and low chemical consumption; First tool...
New ECP ap capability controls the wafer-level electric field to deliver better uniformity within wafer and within die while achieving...