ACM Research, Inc., a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced it has received purchase orders for four wafer-level packaging tools, including two from a U.S.-based customer and two from a U.S.-based research and development (R&D) center.
“We are pleased to receive these strategic orders from both a U.S.-based customer and a leading U.S.-based research center,” said Dr. David Wang, ACM’s President and Chief Executive Officer. “We believe these orders demonstrate the broad range of our advanced wafer-level packaging tools, reaffirm ACM’s commitment to innovation in semiconductor manufacturing, and highlight growing traction with U.S.-based customers.”
The four tools support a range of advanced packaging processes, including coating, developing, wet etching and scrubbing, and are scheduled for delivery in the first half of 2025. The orders from the U.S.-based customer are for first tools subject to technical qualification, which we expect could lead to follow-on orders for volume production. The orders from the R&D center are intended to further advance wafer-level packaging research and development and serve as a demonstration platform to showcase ACM’s technological capabilities to other prospective customers.
