Visit Lintec of America at the 2026 IMAPS SYMPOSIUM! Booth #422
September 28th – October 1st, 2026
Encore Boston Harbor Hotel – Boston, Massachusetts.
If you are attending, please visit our booth. We would love to discuss our lines of tape and equipment.
Tape
- Heat resistant tape *See attached
- Solvent resistant DC tape
- BG tape for bumped wafer
- BG tape for great TTV
- Low particle BG tape
- Back side coating tape (LC tape)
- Bump support film (BSF)
- DAF (LE tape)
Equipment
- Pattern Coating Before Lamination (PCBL) *New
- BG tape laminator
- DC tape laminator
- UV irradiation tool
- Semi-Automatic and Fully Automatic
Oregon office application center
- Product Introduction
Lintec of America, Inc. carries a wide array of products consisting of high-function adhesive tapes and equipment. We are relied upon by the largest semiconductor manufacturers and have received multiple supplier awards for innovations which have moved semiconductor manufacturing forward. We are here to provide 30+ years of expertise to answer your dicing, grinding, and packaging tape related process questions. We look forward to seeing you at the show.
E-mail: order@lintec-usa.com URL: http://www.lintec-usa.com
