MicroCircuit Laboratories (MCL) has officially launched production volumes of its innovative Robotic Cover Sealer (RCS), a new generation of hermetic package seam sealers engineered for high-reliability (hi-rel) microelectronic packaging. [1, 2]
The system transitions the industry away from skilled manual labor, utilizing full automation and advanced PC programming to streamline the entire cover-sealing operation. [1]
Key Features & Capabilities of the RCS
- AI-Driven Teaching: The system is fully automated, removing the dependency on skilled manual operators for lid pick-and-place and perimeter seam sealing. [1]
- Toolless Transitions: An easy-to-use PC program allows a seamless transition from one package configuration to another, completely eliminating the need for special tools, fixtures, or jigs. [1]
- Superior Seal Performance: The RCS delivers hermetic seals with zero gross leaks and fine leak rates that are a decade slower than current industry and aerospace specifications. [1]
- Patent Protection: The United States Patent & Trademark Office (USPTO) has moved to award MCL the initial patents safeguarding this proprietary technology. [1]
Complete Process & Production Support
MCL backs its hardware with vertically integrated, end-to-end support to optimize customer sealing pipelines: [1, 2]
- Custom Process Development: MCL designs custom workflows and delivers a verified Process of Record (POR) for both seam weld and seam AuSn solder hermetic seals.
- Strict Standards Compliance: Seals are designed to meet or exceed rigorous military specifications, including MIL-STD-883 and MIL-STD-750.
- Comprehensive In-House Testing: Support features automated pre-seal deep vacuum bakes, optical microscopy, X-ray inspection, PIND testing, and Internal Vapor Analysis (RGA).
- Lifetime Warranty: All hermetic seals and automated processes engineered by MCL are warranted for the life of the package. [1, 2, 3, 4, 5]
