Temporary wafer bonding processes were initially developed for enabling three-dimensional (3D) stacked integrated circuits (ICs). For example, dies can be...
Fan-out wafer-level packaging (FOWLP) is a cost-effective way to achieve high interconnect density and to manage larger I/O counts within...
Generally, I avoid reading other journalists’ coverage of events I’ve attended until I’ve had a chance to finish my own...
The 2017 3D InCites Awards program has turned out to be the most exciting yet! We had as many as...
Are you familiar with the Japanese custom of cherry blossom viewing? “Hanami (花見, lit. ‘flower viewing’) is the Japanese traditional custom...
Now that the “technology bricks” for building 2.5D devices and 3D ICs have been essentially qualified, the focus has turned...
