Fraunhofer IZM specializes in industry-oriented applied research. Fraunhofer IZM develops assembly and interconnection technology, also known as electronic packaging. Almost invisible and undervalued by many, electronic packaging is at the heart of every electronic application. Our technologies connect the individual components, protect components and devices from vibration and moisture, and reliably dissipate heat. Fraunhofer IZM thus ensures that electronic devices continue to function reliably in even the harshest conditions. Modern packaging technologies make developing smaller and smaller products possible. We process ICs thinner than a sheet of paper. The institute, founded in 1993, has a staff of more than 400 and disposes of a lab area of over 8,000 sqm. About 80 percent of our turnover is earned through contract research.
Fraunhofer IZM’s center “All Silicon System Integration Dresden – ASSID” operates a leading-edge, industry-compatible 200 / 300 mm 3D wafer-level process line (ISO 9001-15) with modules for TSV formation, pre-assembly (thinning, singulation), wafer-level assembly and stack formation. ASSID focuses on process development, material and equipment evaluation as well as R&D services and prototyping for small to mid-size volume manufacturing.
September 20, 2023 The Fraunhofer Institute for Reliability and Microintegration IZM is marking its thirtieth year with a high-profile international...
