Latest Posts
June Member News Highlights Semiconductor Design Tools, Collaborations, and More
This June, we’ve seen exciting strides in AI for semiconductor design, showcasing how AI and Digital Twin technologies are revolutionizing...
ECTC 2024 3D InCites Community Member Preview
2024 is a big year for 3D InCites members at the Electronic Components and Technology Conference (ECTC). With 34 of...
IMAPS DPC 2024 Community Member Preview
IMAPS 20th Annual Device Packaging Conference – Event Highlights The International Microelectronics Assembly and Packaging Society (IMAPS) 20th annual Device...
Community Member Conversations from IMAPS 2023
At the 2023 IMAPS Symposium in October, I had some great community member conversations about some of the hot topics...
Community Member Monthly News – September
Let’s catch up on what we missed among our community… Cadence completed the acquisition of the SerDes and memory...
IMAPS San Diego Community Member Preview
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This...
Community Member Monthly News – August 2023
News you may not have seen this month from our community members. Along with some upcoming participation to keep an...
Community Member Monthly Highlights – July
Lam Research announced quantifiable progress has been made toward its environmental, social and governance (ESG) goals with the release of...
CHIPcon Community Member Preview
The top global event for Chiplet and Heterogeneous Integration Packaging (CHIP), covering advanced technology developments and solutions, device integration strategies,...
2023 ECTC Community Member Preview
Wow, wow, wow, 3D InCites community members are going to be well represented at next week’s Electronics Components Technology Conference...
Community Member Monthly Highlights – April 2023
Cadence, ASE Group, and Chung Yuan Christian University (CYCU) announced collaboration on an education and training program to cultivate talent...
Promex Names David Fromm Chief Operating Officer
Promex, a leader in the assembly of physically small devices that contain semiconductor chips for the medical, biotechnology and communications...
QP Technologies New TQFP and MQFP Offerings Increase Packaging Options for Mil-Aero, Automotive and Other Key Markets
ESCONDIDO, Calif. – March 16, 2023 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has extended its...
IMAPS DPC Community Member Preview
The 19th Annual Device Packaging Conference (DPC 2023) is scheduled for next week, March 13-16, 2023, at the WeKoPa Conference...
Community Member Monthly Highlights – October
Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth...
The Power of Community at the IMAPS International Symposium
One of the things I love most about being part of the International Microelectronics and Packaging Society (IMAPS) is the...
QP Technologies Boosts Process Capabilities, Expands Team to Target New and Growing Markets
Improvements Designed to Meet Escalating Demand for Packaging and Assembly Expertise BOSTON, Oct. 03, 2022 (GLOBE NEWSWIRE) — QP Technologies™...
3DInCites Community Members Well Represented at IMAPS Boston — Here’s a Preview
The 55th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week in Boston with...
