The 55th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week in Boston with...
I usually leave this sort of commentary to Phil Garrou and Dean Freeman. But after a year of debate and...
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components...
IMAPS Device Packaging Conference 2022 takes place next week – March 8-10, here in our home state of Arizona, and...
The IMAPS 2021 program is set to be knowledge-packed, offering materials both in person and on demand, including keynote presentations...
One of the things that are missing from virtual events is the candid conversations we engage in when we meet...
ESCONDIDO, Calif. – August 16, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly...
New brand reflects growing breadth of company’s technology and engineering capabilities ESCONDIDO, Calif. – March 11, 2021 – Leading provider...
Collaboration Targets Packaging for Millimeter-Wave Applications ESCONDIDO, Calif. – OCTOBER 6, 2020 – Quik-Pak, together with Agile Microwave Technology (AgileMwT)...
