Latest Posts - Page 2
IMAPS DPC 2022: Community Member Preview – Keynotes, Technical Tracks and More
IMAPS Device Packaging Conference 2022 takes place next week – March 8-10, here in our home state of Arizona, and...
IMAPS 2021 Community Member Preview
The IMAPS 2021 program is set to be knowledge-packed, offering materials both in person and on demand, including keynote presentations...
How Can We Tap into $52 Billion to Reshore Advanced Packaging?
One of the things that are missing from virtual events is the candid conversations we engage in when we meet...
QP Technologies Installs New Wire Bonders, Broadening Reach in Mil-Aero, RF, Power Markets
ESCONDIDO, Calif. – August 16, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly...
Quik-Pak Becomes QP Technologies™
New brand reflects growing breadth of company’s technology and engineering capabilities ESCONDIDO, Calif. – March 11, 2021 – Leading provider...
