About QP Technologies
Escondido, Calif.-based QP Technologies, a division of Promex Industries, provides wafer preparation, IC packaging and assembly, and substrate design and fabrication services in its 20,000-square-foot ISO 9001:2015/ISO-13485:2016-certified, ITAR-registered facility. The company’s over-molded QFN/DFN packages and pre-molded air-cavity QFN packages offer a fast, convenient solution for customer needs ranging from prototype to volume production. Same-day assembly services reduce customers’ time to market, while advanced assembly services can accommodate such structures as flip-chip, stacked die, SiP, chiplets, MCM and CoB.
QP Technologies News
Promex Industries and QP Technologies Appoint David From President and Chief Operating Officer
Experienced Technology Leader to Drive Innovation and Guide Next Chapter of Operational Growth for Pioneering Microelectronics Assembly Organizations Promex Industries and its QP Technologies division today announced the appointment of David Fromm as president and chief operating officer of both organizations, effective immediately. Fromm brings deep expertise in advanced instrumentation, process development,...
QP Technologies and Parent Company, Promex Industries Implement Sales and Marketing Reorganization
Rosie Medina named senior VP of sales and marketing Promex; Matt Hansen named VP of sales and marketing at QP...
QP Technologies™ Expands Die Preparation Business
Adds Fully Automated Dicing Saw to Equipment Line, Enabling Even Greater Precision, Throughput for Die Singulation QP Technologies™, a leading...
QP Technologies™ Achieves ANSI/ESD S20.20 Certification
Certification and Ongoing Monitoring Assures Customers of Manufacturing Operations’ ESD Control and Safety ESCONDIDO, Calif. – April 11, 2024 –...
Promex Names David Fromm Chief Operating Officer
Promex, a leader in the assembly of physically small devices that contain semiconductor chips for the medical, biotechnology and communications...
QP Technologies New TQFP and MQFP Offerings Increase Packaging Options for Mil-Aero, Automotive and Other Key Markets
ESCONDIDO, Calif. – March 16, 2023 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has extended its...
QP Technologies Boosts Process Capabilities, Expands Team to Target New and Growing Markets
Improvements Designed to Meet Escalating Demand for Packaging and Assembly Expertise BOSTON, Oct. 03, 2022 (GLOBE NEWSWIRE) — QP Technologies™...
QP Technologies Installs New Wire Bonders, Broadening Reach in Mil-Aero, RF, Power Markets
ESCONDIDO, Calif. – August 16, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly...
Quik-Pak Becomes QP Technologies™
New brand reflects growing breadth of company’s technology and engineering capabilities ESCONDIDO, Calif. – March 11, 2021 – Leading provider...
