About QP Technologies
Escondido, Calif.-based QP Technologies, a division of Promex Industries, provides wafer preparation, IC packaging and assembly, and substrate design and fabrication services in its 20,000-square-foot ISO 9001:2015/ISO-13485:2016-certified, ITAR-registered facility. The company’s over-molded QFN/DFN packages and pre-molded air-cavity QFN packages offer a fast, convenient solution for customer needs ranging from prototype to volume production. Same-day assembly services reduce customers’ time to market, while advanced assembly services can accommodate such structures as flip-chip, stacked die, SiP, chiplets, MCM and CoB.
QP Technologies News
Promex Bolsters Leadership Team with David Fromm as Vice President of Engineering
SANTA CLARA, Calif., Feb. 7, 2022 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today...
QP Technologies New TQFP and MQFP Offerings Increase Packaging Options for Mil-Aero, Automotive and Other Key Markets
ESCONDIDO, Calif. – March 16, 2023 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has extended its...
QP Technologies Boosts Process Capabilities, Expands Team to Target New and Growing Markets
Improvements Designed to Meet Escalating Demand for Packaging and Assembly Expertise BOSTON, Oct. 03, 2022 (GLOBE NEWSWIRE) — QP Technologies™...
QP Technologies Installs New Wire Bonders, Broadening Reach in Mil-Aero, RF, Power Markets
ESCONDIDO, Calif. – August 16, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly...
Quik-Pak Becomes QP Technologies™
New brand reflects growing breadth of company’s technology and engineering capabilities ESCONDIDO, Calif. – March 11, 2021 – Leading provider...
