SANTA CLARA, Calif., Feb. 7, 2022 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today...
ESCONDIDO, Calif. – March 16, 2023 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has extended its...
Improvements Designed to Meet Escalating Demand for Packaging and Assembly Expertise BOSTON, Oct. 03, 2022 (GLOBE NEWSWIRE) — QP Technologies™...
ESCONDIDO, Calif. – August 16, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly...
New brand reflects growing breadth of company’s technology and engineering capabilities ESCONDIDO, Calif. – March 11, 2021 – Leading provider...
Collaboration Targets Packaging for Millimeter-Wave Applications ESCONDIDO, Calif. – OCTOBER 6, 2020 – Quik-Pak, together with Agile Microwave Technology (AgileMwT)...