The 19th Annual Device Packaging Conference (DPC 2023) is scheduled for next week, March 13-16, 2023, at the WeKoPa Conference Center, with an anticipated record number in attendance. The microelectronics assembly & advanced packaging event will bring together industry engineers, researchers and top experts participating in a multi-faceted technical program and unique networking events, including:

  • 3-track program with 80+ speakers
  • Poster presentations
  • 4 keynote speakers from Qualcomm, Samsung, General Motors, and Lightmatter
  • Panels covering both business and social value topics
  • GBC Business plenary session: Building the Ecosystem: Transitioning from Research to Manufacturing
  • Sold-out exhibit hall with 66 booths
  • Networking opportunities: welcome reception, exhibit hall reception, poster session happy hour, and group lunches
  • Post-conference golf scramble and guided hike fund raisers

We at 3D InCites will be presenting our annual 3D InCites Awards on the Tuesday morning. Francoise will be moderating the DEI panel Monday night as well as conducting podcast interviews Tuesday and Wednesday. Wednesday evening is the annual poster session and DEI fundraiser event, where you can see this year’s mural in completion, and Thursday we invite you to join us for a hike with proceeds benefiting our DEI fund. It’s shaping up to be another very busy DPC!

Here is a list of who, where and what our community members will be up to…

Community Member Booths:

Finetech 1

MRSI Mycronic 14

TechSearch International 22

Micross 24

KLA 25

Cadence 27

Evatec 25

Amkor Technology 38

DECA 39-40


QP Technologies 43

EV Group 44

ASE Group 47-48

Siemens 49

Adeia 50

StratEdge 51

3D InCites 52

Indium 56

ERS 63


Monday, March 13, 2023

Professional Development Courses


  • 7:00PM-8:00PM

IMAPS/3D InCites DEI Roundtable Discussion on: DEI: It Takes a Village

DEI Chair: 
Robin Davis, Deca Technologies

Moderator & Podcaster: 
Françoise von Trapp, 3D InCites


Tuesday, March 14

  • 9:55am-10:15am

3D InCites Awards
Moderator: Francoise von Trapp, 3D InCites


Technical Tracks

Several members are chairing of each of the three Technical Tracks:

Heterogeneous 2D & 3D Integration
Mike Kelly, Amkor Technology

Fan-Out, Wafer Level Packaging & Flip Chip

Craig Bishop, Deca
Curtis Zwenger, Amkor Technology

Next Gen Applications (Automotive, 5G/6G…)

Vik Chaudhry, Amkor Technology


Notable Tuesday Sessions:


Scaling Interconnect Densities to Meet the Growing Demand for Chiplet Integration
Robin Davis, Deca Technologies (Tim Olson)


Heterogenous Integration: Simplifying the Landscape
Michael Kelly, Amkor Technology, Inc. (Dave Hiner, George Scott)

Understanding Warpage Behavior on Different Handling Platforms of FOWLP        
Debbie-Claire Sanchez, ERS electronic GmbH


Universal Chiplet Interconnect Express™ (UCIe™) – Building an Open Ecosystem of Chiplets for On-package Innovations
Vik Chaudhry, Amkor Technology

5G/6G MAESTRO Materials: Glass Substrates for mmWave/sub-THz Applications
Paul Ballentine, Mosaic Microsystems (Shelby Nelson)


Using M-Series with Adaptive Patterning to shrink PCB systems into System-In-Packages
Justin Locke, Siemens EDA (Robin Davis, Deca Technologies)


Performance enablement through Advanced FOPOP for Networking and Mobile
Mark Gerber, ASE Group (Nathan Whitchurch, Amkor Technology)

Advanced Insulation Materials for Next Generation High-Density Package  

Shohei Fujishima, Research Institute for bioscience Products & Fine Chemicals, Ajinomoto Co., Inc.


Squaring Off with M-Series Fan-Out Technology
Clifford Sandstrom, Deca Technologies (Benedict San Jose, Deca Technologies; Jen-Kuang Fang, Ping-Feng Yang, Sheng Feng-Huang, Ping-Ching Shen, ASE)


Novel IR Laser Debonding for Heterogeneous Integration and 3D Integration

Thomas Uhrmann, EV Group (Peter    Urban, Markus Wimplinger, Boris Povazay, Julian Bravin, Bernd Thallner)


Tuesday Evening Panel Discussion

  • 6:30pm-8:00pm (ROOM 107-108)


E. Jan Vardaman, President and Founder, TechSearch International, Inc.


SP Jeng, TSMC | Director, Advanced Packaging Technology & Service Group
Mike Kelly, Amkor Technology | VP, Advanced Packaging Development and Integration
Choon Lee, JCET Group | Chief Technology Officer
Ravi Mahajan, Intel Corp. | Intel Fellow
Chris Scanlan, Besi Switzerland AG | Senior Vice President Technology


Wednesday, March 15

Technical Tracks

Notable Wednesday Afternoon Sessions:


D2W Hybrid Bonding using high accuracy carrier solutions for 3D System Integration
Thomas Uhrmann, EV Group (Jürgen Burggraf, Mariana Pires, EV Group; Chun Ho Fan, Hoi Ping Ng, Ming Li, ASMPT)


High-yield Fabrication of Thin Glass Interposers
Shelby Nelson, Mosaic Microsystems, LLC (David Levy, Kyle Liddle, Patrick Borrelli)

Advanced IC Substrates for Heterogeneous Integration
Markus Leitgeb, AT&S (Venkata Mokkapati, Rozalia Beica)


Creating Systems from Chiplets – Next Generation Integration Driven by Hybrid Bonding
Robert Patti, NHanced Semiconductors,Inc.


Hybrid Bond Interconnect for Advanced Packaging Solutions
Thomas Workman, Adeia Inc. (Gill Fountain, Laura Mirkarimi, Guilian Gao, Jeremy Theil, Bongsub Lee)

Optimizing New Power Switch Technology Using Flip-Chip Assembly
Sam Sadri, QP Technologies (Jiankang Bu, Ideal Power)



Wednesday 6-8pm on the Patio


Thursday, March 16

HIKE FOR DEI, Sponsored by KLA

If you’re not participating in the golf tournament, why not join us for a guided, afternoon hike in the nearby McDowell Sonoran Preserve? All proceeds benefit the 3D InCites DEI Fund, established to help tech start-ups owned by women and under-represented minorities grow and thrive. Sign up here.

When: Thursday, March 16 from 12:30pm-4pm

Trine Pierik

Trine Pierik is the 3D InCites community membership director. She is responsible and committed to…

View Trine's posts

Become a Member

Media Kit