My name is Devan Mederios, and I recently had an eight-month-long internship at Mosaic Microsystems. I had an incredible experience...
The IMAPS 2021 program is set to be knowledge-packed, offering materials both in person and on demand, including keynote presentations...
Microelectronics and Photonics Packaging Company to Apply Additional Seed Investment to Continue Aggressive Growth Initiatives. New York Ventures Provides Capital to...
The 17th Annual Device Packaging Conference (DPC 2021) will be held as an online global event, from April 12-15, 2021. It is an international...
We took our annual mural project online this year! Illustrator Ronna Encarnacion created this original watercolor to reflect the importance...
For the last several years, we held the 3D InCites Mural Project, in conjunction with the 3D InCites Awards, in...
Mosaic Microsystems, a microelectronics and photonics packaging company providing thin glass substrates and through-glass vias (TGVs) for next-generation products in...
Microelectronics and photonics packaging company receives funding to further accelerate technology roadmap Rochester, NY — Mosaic Microsystems, a microelectronics and photonics...
Chandler, Arizona, USA, February 12th, 2020 – Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer...
2020 has been a year for the books. Honestly, between the divisiveness in the USA caused by this year’s election...
Because IMAPS is a society, there is a strong community aspect to its events. It was good to see that...
Virtual IWLPC kicks off on October 13, 2020, and 3D InCites community members will be well represented, from the panel...
Rochester, NY — Mosaic Microsystems, a microelectronics and photonics packaging company, providing thin glass substrates and through glass vias (TGVs) for...
Glass has many properties that make it an ideal substrate for interposers such as: ultra-high resistivity and low electrical loss,...
