IMAPS held its Arizona Chapter Event at Deca Technologies, which included a presentation from Clifford Sandstrom on: “Achieving High-Density Die-to-Die Integration with Adaptive Pad Stacks on Molded Embedded Bridge Die Interposers,” and a happy hour of networking.
MKS/Atotech was in attendance at the TPCA Show 2023 showcasing advanced process, laser drilling and plating system solutions to accelerate the development of high performance computing, artificial intelligence and more complex key electronic components used in smartphones and automobiles. The company also hosted an IMPACT Industrial session on “AI advanced packaging” and presented 8 additional technical papers at this year’s IMPACT conference..
ASE received the Red Dot Design Award, after being nominated in the ‘Brands & Communication Design’ category. Recognized during a special ceremony in Berlin, Germany, the award winning entry is an ASE video that captivated judges with its creative and compelling portrayal of the ASE brand. Established in 1955, the Red Dot Design Awards stand as one of the world’s largest and most influential design competitions.
Sensor integration experts from Fraunhofer IZM are working with a European consortium in the CHARM ECSEL Project to develop new solutions for the Internet of Things under the demanding conditions of industrial reality. The current investigations are focusing in particular on the realization of sensor technology for harsh environmental conditions that are exposed to dust, moisture or radiation. Fraunhofer IZM is contributing its expertise in the field of process development for reliable sensor integration. Results have been incorporated into a guideline for the low-stress encapsulation of sensor technology in the fan-out panel-level packaging process.
Cadence Design Systems was honored with the number 9 spot on Fortune’s ‘Great Place To Work US’ World’s Best Workplaces 2023 list.
Cadence Design Systems customers enjoyed an exclusive event hosted at its technology partner McLaren Racing headquarters, where Cadence showcased its latest DSG AI technologies around the theme “AI-Driven Chip Design Delivering Better Results More Quickly.”
Shelby F. Nelson of Mosaic Microsystems presented, “Glass Substrate for Packaging” at the iNEMI/ZESTRON workshop, Advanced Packaging and Its Impact on mmWave Applications, in Manassas, Virginia. The full-day workshop brings together industry-based and academic researchers to talk about the challenges of advanced packaging and its intersection with high-frequency (mmWave) materials.
Amkor Technology, Inc. presented at the inaugural ISES Southeast Asia 2023 conference in Malaysia. Amkor’s Jinyoung Kim, SVP of Global R&D Strategy, presented the evolving landscape of system-level packaging in the semiconductor industry. He highlighted advancements in circuits and subsystems using diverse packaging technologies across computing, networking, artificial intelligence, mobile, and automotive sectors. JinYoung emphasized innovations such as chiplets and interposer technologies, detailing their impact on yield improvement in wafer fabrication.
Siemens Digital Industries Software announced Red Bull Ford Powertrains is using the Siemens Xcelerator portfolio of industry software to develop a new hybrid power unit for 2026 racing season.
Cadence Design Systems announced that the Cadence® EMX® 3D Planar Solver is now certified for use with Samsung Foundry’s advanced 8nm Low Power Plus (LPP) process technology. The EMX Solver is the first electromagnetic (EM) solver on the market to achieve this milestone, having successfully passed all of Samsung’s detailed certification criteria.
Siemens Digital Industries Software completed the acquisition of Insight EDA Inc., an EDA software company delivering groundbreaking circuit reliability solutions to many of the world’s leading integrated circuit (IC) design teams. Insight EDA has been a pioneer in the use of EDA automation to address design specific circuit reliability, bringing in new and more efficient circuit reliability analysis use models to the industry. The addition of the Insight EDA technology to Siemens’ Calibre PERC product portfolio is anticipated to empower chip designers with an end-to-end circuit reliability solution.
