Mosaic Microsystems

About Mosaic Microsystems

Mosaic Microsystems is a microelectronics and photonics packaging company located in Rochester, NY. Mosaic delivers robust solutions to enable thin glass products for exciting initiatives in RF communications, particularly for 5G, as well as advanced packaging, MEMs and sensors for the internet of things (IoT). Mosaic’s solutions provide customers with the ability to establish high volume manufacturing of thin glass solutions using existing industry standard equipment and processes.

At the heart of Mosaic’s solution is a proprietary temporary bond technology, which uses innovative approaches to support thin glass substrates during downstream processing.

Key features and benefits of the Mosaic platform include:

• An extremely thin temporary bonding layer, allowing for precision via fill with conductive materials using current semiconductor processes and equipment
• Ability to process at elevated temperatures > 400 C
• No outgas from the temporary bond layer
• A mechanical de-bond that leverages existing industry processes

Mosaic’s solutions provide customers with the ability to establish high volume manufacturing of thin glass products using existing industry standard equipment and processes. This makes the advantaged, low loss properties of glass-based solutions available for integration into a broad range of applications.