Latest Posts
IFTLE 622: US Joint Consortium; Intel Rumors
When I was first asked why I had not yet covered the “US Joint Consortium” I responded “tongue in cheek”...
US-JOINT Consortium: Strengthening Advanced Packaging Innovation Across Borders
As global semiconductor demand continues to surge, international collaboration has become essential for driving technological innovation. The US-JOINT consortium represents...
SEMICON Taiwan 2024 “Breaking Limits” Member Preview
Taking place from September 3-6, SEMICON Taiwan 2024 is just around the corner. With this year’s theme, Breaking Limits: Powering...
July Member News: Progress in Sustainability, Industry Expansion, and Technology Innovation
July is always an exciting month for the semiconductor industry thanks to SEMICON West. July Member News reflects the significant...
SEMICON West 2024 “Stronger Together” Member Preview
SEMICON West 2024 is themed Stronger Together. SEMI’s message of the year is focused on the need for global collaboration...
ECTC 2024 3D InCites Community Member Preview
2024 is a big year for 3D InCites members at the Electronic Components and Technology Conference (ECTC). With 34 of...Are We Moving Fast Enough on Semiconductor Sustainability?
We continue to deal with a paradox: semiconductor chips are necessary to support digitalization and society’s transition to lower carbon...
SEMICON Europa 2023 Community Member Preview
SEMICON Europa 2023, co-located with productronica in Munich, Germany makes for one of the strongest single events for electronics manufacturing...
IMAPS San Diego Community Member Preview
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This...
CHIPcon Community Member Preview
The top global event for Chiplet and Heterogeneous Integration Packaging (CHIP), covering advanced technology developments and solutions, device integration strategies,...
2023 ECTC Community Member Preview
Wow, wow, wow, 3D InCites community members are going to be well represented at next week’s Electronics Components Technology Conference...
IMAPS DPC Community Member Preview
The 19th Annual Device Packaging Conference (DPC 2023) is scheduled for next week, March 13-16, 2023, at the WeKoPa Conference...
ECTC 2022 Member Preview — Stacked and Packed
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components...
2022 IMAPS DPC: Back and Better Than Ever
After two years of virtual conferences, it was great to be back in person last week at the 2022 IMAPS...
IMAPS DPC 2022: Community Member Preview – Keynotes, Technical Tracks and More
IMAPS Device Packaging Conference 2022 takes place next week – March 8-10, here in our home state of Arizona, and...
IFTLE 493: TSMC Considering Chip Packaging in Japan; US “On Shoring” Report Issued
Will TSMC build advanced packaging facilities offshore? In IFTLE 490, we reported that TSMC is considering building an advanced IC...
ECTC 2021 Features the Hottest Topics and Trends in Microelectronics
For the second time in its 71-year history, ECTC will be presented as a virtual conference, opening Tuesday, June 1,...
DPC 2021 Online Event Stacked with Community Members Leading Speaker Sessions
The 17th Annual Device Packaging Conference (DPC 2021) will be held as an online global event, from April 12-15, 2021. It is an international...
