Latest Posts
February Member Highlights – Acquisitions, Awards, Events, New Offerings and More
The 3D InCites community members continue to create a buzz with announcements from new acquisitions to industry awards, new product...
AT&S Establishes the Cleanest Working Environment in Syria
270 employees have already been hired for the new research and production center in Leoben. A further 300 new skilled...
Community Member Monthly News – October
October flew by and our community members were busy… Deca was the recipient of the prestigious IMAPS Corporate Recognition Award...
AT&S and Casio Make Durable G-SHOCK Watch Smart
Leoben, October 25, 2023 – For 40 years now, Casio’s renowned G-SHOCK watches have been used when exact time keeping...
Artificial Intelligence Confirms: AT&S Has the Highest Reputation in Austria’s Industry
Leoben, October 5, 2023 – The Styria-based technology group is economically successful in challenging times and has an excellent reputation...
IMAPS San Diego Community Member Preview
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This...
Community Member Monthly News – August 2023
News you may not have seen this month from our community members. Along with some upcoming participation to keep an...
SEMI 3D & Systems Summit Community Member Preview
SEMI 3D & Systems Summit to Spotlight Latest Trends in Heterogeneous Integration, Hybrid Bonding, Chiplet Design and Photonics Leading experts...
2023 ECTC Community Member Preview
Wow, wow, wow, 3D InCites community members are going to be well represented at next week’s Electronics Components Technology Conference...
Community Member Monthly Highlights – April 2023
Cadence, ASE Group, and Chung Yuan Christian University (CYCU) announced collaboration on an education and training program to cultivate talent...
IMAPS DPC Community Member Preview
The 19th Annual Device Packaging Conference (DPC 2023) is scheduled for next week, March 13-16, 2023, at the WeKoPa Conference...
AT&S At Two Advanced Packaging Conferences
At the invitation of TSMC (Taiwan Semiconductor Manufacturing Company), Rozalia Beica (VP Strategic Marketing & Business Development in Microelectronics Business Unit) participated in the IMPACT conference in Taipei...