At the invitation of TSMC (Taiwan Semiconductor Manufacturing Company), Rozalia Beica (VP Strategic Marketing & Business Development in Microelectronics Business Unit) participated in the IMPACT conference in Taipei from Oct 26 to 28. She attended the “Heterogeneous Integration” session on October 27 with a virtual presentation focused on “Enabling Heterogeneous Integration Through Advanced Interconnect Technologies”. Rozalia has acted as one of the members of the International Advisory Committee, supporting this event for several years. The IMPACT 2022 Conference, which is organized by IEEE-EPS-TaipeiiMAPS-TaiwanITRI, and TPCA, is the largest gathering of PCB and packaging professionals in Taiwan.

The SiP China, one of the global significant System in Package (SiP) focused events, was held in Shenzhen from Nov 5 to 6. As one of the members of the Executive Committee, Rozalia Beica has supported this conference since it had been established. Together with Informa team, General Chair Nozad Karim, SVP with Amkor, and Feng Lin, CEO Xpedic. she organized this year’s event and delivered a presentation with the topic of “Advanced IC Substrates: A Critical Component of Heterogeneous Integration” during the session of SiP Substrate & Assembly.

“Both events had a great success. Over 1000 professionals attended SiP China. It is always a great honor to support and participate in these premier Advanced Packaging conferences in Taiwan and China and we are very glad to see the high interest in AT&S’s technologies. This not only shows that we are on the right path, but also that innovation and new technologies we bring to the market are relevant and of interest to the Advanced Packaging community”, said Rozalia.



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